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NP352-1206-38 PDF预览

NP352-1206-38

更新时间: 2024-02-16 12:56:39
品牌 Logo 应用领域
YAMAICHI 插座插槽和芯片载体PC
页数 文件大小 规格书
8页 559K
描述
Fine Ball Grid Array (FBGA, 1.00mm Pitch)

NP352-1206-38 技术参数

生命周期:Contact ManufacturerReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8536.69.40.40
风险等级:5.67Is Samacsys:N
主体宽度:2.441 inch主体长度:2.441 inch
联系完成配合:AU ON NI联系完成终止:GOLD OVER NICKEL
触点材料:BE-CU触点样式:DUAL PRONG
设备插槽类型:IC SOCKET使用的设备类型:BGA1206
介电耐压:100VAC V绝缘电阻:1000000000 Ω
插接触点节距:0.039 inch安装方式:STRAIGHT
触点数:1206最高工作温度:150 °C
PCB接触模式:RECTANGULAR端接类型:SOLDER
Base Number Matches:1

NP352-1206-38 数据手册

 浏览型号NP352-1206-38的Datasheet PDF文件第2页浏览型号NP352-1206-38的Datasheet PDF文件第3页浏览型号NP352-1206-38的Datasheet PDF文件第4页浏览型号NP352-1206-38的Datasheet PDF文件第5页浏览型号NP352-1206-38的Datasheet PDF文件第6页浏览型号NP352-1206-38的Datasheet PDF文件第7页 
NP352 Series (Open Top)  
Fine Ball Grid Array (FBGA, 1.00mm Pitch)  
Part Num ber (Details)  
Specifications  
W
1,000M m in. at 100V DC  
Insulation Resistance:  
-
-
-
* *  
NP352  
Series No.  
560 09  
Dielectric Withstanding Voltage: 100V AC for 1 m inute  
W
Contact Resistance:  
100m m ax. at 10m A/20m V m ax.  
Operating Tem perature Range: –40°C to +150°C / -55°C to +150°C  
No. of Contact Pins  
Design Num ber  
Contact Force:  
Mating Cycles:  
15g per pin approx.  
10,000 insertions m inim un  
Mark for Positioning Pins  
Contact Term inal Lengths and Form  
Materials and Finish  
Features  
Housing:  
Polyetherim ide (PEI), glass-filled  
í Open top type sockets with "Tweezer Style Contacts"  
Polyethersulphone (PES), glass-filled  
For FBGA packages  
Contacts:  
Plating:  
Beryllium Copper (BeCu)  
Gold over Nickel  
í Secure package alignm ent due to self contacting structure  
without upper pressing force (ZIF)  
í Contacting structure to nip the sides of solder balls to lower  
dam ages of coplanarity of solder balls  
Outline Base Socket Dim ensions  
A±0.4  
Yam aichi's 2-point Tweezer Contact  
IC  
Ball  
Socket  
Base A  
Since the solder balls are touched  
by two contacts on each side,  
the solder ball dam age can be  
m inim ized; additional features  
are low actuation force and  
com pact socket size  
Contacts  
Socket  
Base B  
Test & Burn-In  
SPECIFICATIONS ARE SUBJ ECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER  
D-36  

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