Datasheet > NP352-129636

NP352-129636

更新时间： 2022-12-17 06:23:45

品牌	Logo	应用领域
YAMAICHI		栅
页数	文件大小	规格书
8页	559K
描述
Fine Ball Grid Array (FBGA, 1.00mm Pitch)

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NP352-129636 数据手册

NP352 Series (Open Top)

Fine Ball Grid Array (FBGA, 1.00mm Pitch)

Part Num ber (Details)

Specifications

1,000M m in. at 100V DC

Insulation Resistance:

* *

NP352

Series No.

560 09

Dielectric Withstanding Voltage: 100V AC for 1 m inute

Contact Resistance:

100m m ax. at 10m A/20m V m ax.

Operating Tem perature Range: –40°C to +150°C / -55°C to +150°C

No. of Contact Pins

Design Num ber

Contact Force:

Mating Cycles:

15g per pin approx.

10,000 insertions m inim un

Mark for Positioning Pins

Contact Term inal Lengths and Form

Materials and Finish

Features

Housing:

Polyetherim ide (PEI), glass-filled

í Open top type sockets with "Tweezer Style Contacts"

Polyethersulphone (PES), glass-filled

For FBGA packages

Contacts:

Plating:

Beryllium Copper (BeCu)

Gold over Nickel

í Secure package alignm ent due to self contacting structure

without upper pressing force (ZIF)

í Contacting structure to nip the sides of solder balls to lower

dam ages of coplanarity of solder balls

Outline Base Socket Dim ensions

A±0.4

Yam aichi's 2-point Tweezer Contact

Ball

Socket

Base A

Since the solder balls are touched

by two contacts on each side,

the solder ball dam age can be

m inim ized; additional features

are low actuation force and

com pact socket size

Contacts

Socket

Base B

Test & Burn-In

SPECIFICATIONS ARE SUBJ ECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

D-36

12 3 4 5 6 7 8

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