NP352 Series (Open Top)
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
Part Num ber (Details)
Specifications
W
1,000M m in. at 100V DC
Insulation Resistance:
-
-
-
* *
NP352
Series No.
560 09
Dielectric Withstanding Voltage: 100V AC for 1 m inute
W
Contact Resistance:
100m m ax. at 10m A/20m V m ax.
Operating Tem perature Range: –40°C to +150°C / -55°C to +150°C
No. of Contact Pins
Design Num ber
Contact Force:
Mating Cycles:
15g per pin approx.
10,000 insertions m inim un
Mark for Positioning Pins
Contact Term inal Lengths and Form
Materials and Finish
Features
Housing:
Polyetherim ide (PEI), glass-filled
í Open top type sockets with "Tweezer Style Contacts"
Polyethersulphone (PES), glass-filled
For FBGA packages
Contacts:
Plating:
Beryllium Copper (BeCu)
Gold over Nickel
í Secure package alignm ent due to self contacting structure
without upper pressing force (ZIF)
í Contacting structure to nip the sides of solder balls to lower
dam ages of coplanarity of solder balls
Outline Base Socket Dim ensions
A±0.4
Yam aichi's 2-point Tweezer Contact
IC
Ball
Socket
Base A
Since the solder balls are touched
by two contacts on each side,
the solder ball dam age can be
m inim ized; additional features
are low actuation force and
com pact socket size
Contacts
Socket
Base B
Test & Burn-In
SPECIFICATIONS ARE SUBJ ECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
D-36