Datasheet > PBRP123ET,215

PBRP123ET,215

更新时间： 2024-01-06 07:00:19

品牌	Logo	应用领域
恩智浦 - NXP		开关光电二极管晶体管
页数	文件大小	规格书
12页	104K
描述
PBRP123ET - PNP 800 mA, 40 V BISS RET; R1 = 2.2 kOhm, R2 = 2.2 kOhm TO-236 3-Pin

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技术参数
数据手册

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PBRP123ET,215 技术参数

生命周期：	Active	零件包装代码：	TO-236
包装说明：	SMALL OUTLINE, R-PDSO-F3	针数：	3
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8541.21.00.95	风险等级：	1.02
其他特性：	BUILT-IN BIAS RESISTOR RATIO 1	最大集电极电流 (IC)：	0.6 A
集电极-发射极最大电压：	40 V	配置：	SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE)：	250	JEDEC-95代码：	TO-263AB
JESD-30 代码：	R-PDSO-F3	JESD-609代码：	e3
湿度敏感等级：	1	元件数量：	1
端子数量：	3	封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260	极性/信道类型：	PNP
表面贴装：	YES	端子面层：	Tin (Sn)
端子形式：	FLAT	端子位置：	DUAL
处于峰值回流温度下的最长时间：	30	晶体管应用：	SWITCHING
晶体管元件材料：	SILICON	Base Number Matches：	1

PBRP123ET,215 数据手册

PBRP123ET

PNP 800 mA, 40 V BISS RET; R1 = 2.2 kΩ, R2 = 2.2 kΩ

Rev. 01 — 16 January 2008

Product data sheet

1. Product proﬁle

1.1 General description

800 mA PNP low V_CEsatBreakthrough In Small Signal (BISS) Resistor-Equipped

Transistor (RET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic

package.

NPN complement: PBRN123ET.

1.2 Features

I 800 mA repetitive peak output current

I Low collector-emitter saturation voltage

V_CEsat

I High current gain h_FE

I Built-in bias resistors

I Simpliﬁes circuit design

I Reduces component count

I Reduces pick and place costs

I ±10 % resistor ratio tolerance

1.3 Applications

I Digital application in automotive and

industrial segments

I Switching loads

I Medium current peripheral driver

1.4 Quick reference data

Table 1.

Symbol

V_CEO

I_O

Quick reference data

Parameter

Conditions

Min

Typ

Max

−40

Unit

collector-emitter voltage

output current

open base

[1][2]

[3]

−600

−800

I_ORM

repetitive peak output current t_p≤ 1 ms;

δ ≤ 0.33

bias resistor 1 (input)

bias resistor ratio

1.54

0.9

2.2

2.86

1.1

kΩ

R2/R1

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for

collector 1 cm².

[2] Device mounted on a ceramic PCB, Al₂O₃, standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

12 3 4 5 6 7...12

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