ICS9LPRS525
PC MAIN CLOCK
NOTES on Input/Supply/Common Output DC Parameters: (unless otherwise noted, guaranteed by design and characterization, not 100% tested in production).
1Signal is required to be monotonic in this region.
2 input leakage current does not include inputs with pull-up or pull-down resistors
3 3.3V referenced inputs are: PCI_STOP#, CPU_STOP#, TME, SRC5_EN, ITP_EN, SCLKL, SDATA, TESTMODE, TESTSEL, CKPWRGD and CR# inputs if selected.
4 Intentionally blank
5 Maximum VIH is not to exceed VDD
6 Human Body Model
7 Operation under these conditions is neither implied, nor guaranteed.
8 Frequency Select pins which have tri-level input
9 PCI3/CFG0 is optional
10 If present. Not all parts have this feature.
AC Electrical Characteristics - Low Power Differential Outputs
PARAMETER
Rising Edge Slew Rate
Falling Edge Slew Rate
Slew Rate Variation
Differential Voltage Swing
Crossing Point Voltage
Crossing Point Variation
Maximum Output Voltage
Minimum Output Voltage
Duty Cycle
SYMBOL
tSLR
tFLR
tSLVAR
VSWING
VXABS
CONDITIONS
Averaging on
Averaging on
Averaging on
Averaging off
Averaging off
Averaging off
Averaging off
Averaging off
MIN
2.5
2.5
MAX
4
4
UNITS NOTES
V/ns
V/ns
%
mV
mV
mV
mV
mV
%
2, 3
2, 3
1, 10
2
1,4,5
1,4,9
1,7
1,8
2
20
300
300
550
140
1150
VXABSVAR
VHIGH
VLOW
DCYC
CPUSKEW10
CPUSKEW20
SRCSKEW
-300
45
Averaging on
55
100
150
3000
CPU[1:0] Skew
CPU[2_ITP:0] Skew
SRC[10:0] Skew
Differential Measurement
Differential Measurement
Differential Measurement
ps
1
ps
1
ps
1,6,11
NOTES on DIF Output AC Specs: (unless otherwise noted, guaranteed by design and characterization, not 100% tested in production).
1Measurement taken for single ended waveform on a component test board (not in system)
2 Measurement taken from differential waveform on a component test board. (not in system)
3 Slew rate emastured through V_swing voltage range centered about differential zero
4 Vcross is defined at the voltage where Clock = Clock#, measured on a component test board (not in system)
5 Only applies to the differential rising edge (Clock rising, Clock# falling)
6 Total distributed intentional SRC to SRC skew. PCIE Gen2 outputs (SRC3, 4, 6 and 7) will have 0 nominal skew. Maximum allowable interpair skew is 150 ps.
7 The max voltage including overshoot.
8 The min voltage including undershoot.
9 The total variation of all Vcross measurements in any particular system. Note this is a subset of V_cross min/mas (V_Cross absolute) allowed. The intent is to limit Vcross induced
modulation by setting C_cross_delta to be smaller than V_Cross absolute
10 Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on the average cross point where Clock rising meets
Clock# falling. The median cross point is used to calculate the voltage
11 For PCIe Gen2 compliant devices, SRC 3, 4, 6, and 7 will have 0 ps nominal skew.
Clock Jitter Specs - Low Power Differential Outputs
PARAMETER
SYMBOL
CPUJC2C
SRCJC2C
DOTJC2C
CONDITIONS
MIN
MAX
85
125
250
UNITS NOTES
CPU Jitter - Cycle to Cycle
SRC Jitter - Cycle to Cycle
DOT Jitter - Cycle to Cycle
Differential Measurement
Differential Measurement
Differential Measurement
ps
ps
ps
1
1,2
1
NOTES on DIF Output Jitter: (unless otherwise noted, guaranteed by design and characterization, not 100% tested in production).
1JItter specs are specified as measured on a clock characterization board. System designers need to take special care not to use these numbers, as the in-system performance will be
somewhat degraded. The receiver EMTS (chispet or CPU) will have the rece
2
Phase jitter requirement: The deisgnated Ge2 outputs will meet the reference clock jitter requiremernts from the PCI Express Gen2 Base Spec. The test is performed on a componnet
test board under quiet condittions with all outputs on. Jitter analysis is performed using a standardized tool provided by the PCI SIG or equivalent. Measurement methodology is as defined
by the PCI SIG.
IDTTM/ICSTM PC MAIN CLOCK
1484A—04/28/09
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