是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | DFN | 包装说明: | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
Factory Lead Time: | 5 weeks | 风险等级: | 5.43 |
最大时钟频率 (fCLK): | 2 MHz | JESD-30 代码: | R-PDSO-N8 |
JESD-609代码: | e4 | 长度: | 3 mm |
内存密度: | 4096 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 16 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 256 words | 字数代码: | 256 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 组织: | 256X16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVSON |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
座面最大高度: | 0.8 mm | 串行总线类型: | MICROWIRE |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 2 mm |
最长写入周期时间 (tWC): | 6 ms | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
93AA66BT-I/MNY | MICROCHIP |
类似代替 |
256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLA |
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256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | |
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4K Microwire Compatible Serial EEPROM | |
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256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | |
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4K Microwire Compatible Serial EEPROM | |
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4K Microwire Compatible Serial EEPROM | |
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4K Microwire Compatible Serial EEPROM | |
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4K Microwire Compatible Serial EEPROM | |
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4K Microwire Compatible Serial EEPROM | |
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256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC- |