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93C56A-E/SN PDF预览

93C56A-E/SN

更新时间: 2024-01-14 06:44:39
品牌 Logo 应用领域
美国微芯 - MICROCHIP 存储内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟
页数 文件大小 规格书
28页 470K
描述
2K Microwire Compatible Serial EEPROM

93C56A-E/SN 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:0.150 INCH, PLASTIC, SOIC-8针数:8
Reach Compliance Code:unknownFactory Lead Time:6 weeks
风险等级:5.65其他特性:10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS
备用内存宽度:16最大时钟频率 (fCLK):2 MHz
数据保留时间-最小值:40耐久性:1000000 Write/Erase Cycles
JESD-30 代码:R-PDSO-G8JESD-609代码:e0
内存密度:2048 bit内存集成电路类型:EEPROM
内存宽度:8功能数量:1
端子数量:8字数:256 words
字数代码:256工作模式:SYNCHRONOUS
最高工作温度:125 °C最低工作温度:-40 °C
组织:256X8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:SERIAL
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified串行总线类型:MICROWIRE
最大待机电流:0.0001 A子类别:EEPROMs
最大压摆率:0.004 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最长写入周期时间 (tWC):1 ms写保护:SOFTWARE
Base Number Matches:1

93C56A-E/SN 数据手册

 浏览型号93C56A-E/SN的Datasheet PDF文件第3页浏览型号93C56A-E/SN的Datasheet PDF文件第4页浏览型号93C56A-E/SN的Datasheet PDF文件第5页浏览型号93C56A-E/SN的Datasheet PDF文件第7页浏览型号93C56A-E/SN的Datasheet PDF文件第8页浏览型号93C56A-E/SN的Datasheet PDF文件第9页 
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C  
2.2  
Data In/Data Out (DI/DO)  
2.0  
FUNCTIONAL DESCRIPTION  
It is possible to connect the Data In and Data Out pins  
together. However, with this configuration it is possible  
for a “bus conflict” to occur during the “dummy zero”  
that precedes the read operation, if A0 is a logic high  
level. Under such a condition the voltage level seen at  
Data Out is undefined and will depend upon the relative  
impedances of Data Out and the signal source driving  
A0. The higher the current sourcing capability of A0,  
the higher the voltage at the Data Out pin. In order to  
limit this current, a resistor should be connected  
between DI and DO.  
When the ORG pin (93XX56C) pin is connected to  
VCC, the (x16) organization is selected. When it is  
connected to ground, the (x8) organization is selected.  
Instructions, addresses and write data are clocked into  
the DI pin on the rising edge of the clock (CLK). The DO  
pin is normally held in a High-Z state except when read-  
ing data from the device, or when checking the Ready/  
Busy status during a programming operation. The  
Ready/Busy status can be verified during an Erase/  
Write operation by polling the DO pin; DO low indicates  
that programming is still in progress, while DO high  
indicates the device is ready. DO will enter the High-Z  
state on the falling edge of CS.  
2.3  
Data Protection  
All modes of operation are inhibited when VCC is below  
a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices  
or 3.8V for ‘93C’ devices.  
2.1  
START Condition  
The Start bit is detected by the device if CS and DI are  
both high with respect to the positive edge of CLK for  
the first time.  
The EWEN and EWDS commands give additional  
protection against accidentally programming during  
normal operation.  
Before a Start condition is detected, CS, CLK and DI  
may change in any combination (except to that of a  
Start condition), without resulting in any device  
operation (Read, Write, Erase, EWEN, EWDS, ERAL  
or WRAL). As soon as CS is high, the device is no  
longer in Standby mode.  
Note:  
For added protection, an EWDS command  
should be performed after every write  
operation and an external 10 kΩ pull-down  
protection resistor should be added to the  
CS pin.  
An instruction following a Start condition will only be  
executed if the required opcode, address and data bits  
for any particular instruction are clocked in.  
After power-up, the device is automatically in the  
EWDS mode. Therefore, an EWENinstruction must be  
performed before the initial ERASEor WRITEinstruction  
can be executed.  
Note:  
When preparing to transmit an instruction,  
either the CLK or DI signal levels must be  
at a logic low as CS is toggled active high.  
Block Diagram  
VCC  
VSS  
Address  
Decoder  
Memory  
Array  
Address  
Counter  
DO  
Output  
Buffer  
Data Register  
DI  
Mode  
Decode  
Logic  
ORG*  
CS  
Clock  
Register  
CLK  
*ORG input is not available on A/B devices  
DS21794E-page 6  
© 2007 Microchip Technology Inc.  

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