NXP Semiconductors
Data Sheet: Technical Data
Document Number: MPC5606B
Rev. 5, 11/2017
MPC5606BK
144 LQFP
100 LQFP
20 mm x 20 mm
14 mm x 14 mm
MPC5606BK Microcontroller
Data Sheet
176 LQFP
24 mm x 24 mm
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Device comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.4 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . 4
2.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Pin muxing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.2 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . 27
3.4 Recommended operating conditions . . . . . . . . . . . . . . . 28
3.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.6 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . . 33
3.7 RESET electrical characteristics . . . . . . . . . . . . . . . . . . 45
3.8 Power management electrical characteristics . . . . . . . . 48
3.9 Power consumption in different application modes . . . . 53
3.10 Flash memory electrical characteristics . . . . . . . . . . . . . 54
3.11 Electromagnetic compatibility (EMC) characteristics . . . 56
3.12 Fast external crystal oscillator (4 to 16 MHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
3.13 Slow external crystal oscillator (32 kHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
3.14 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . . 63
3.15 Fast internal RC oscillator (16 MHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
3.16 Slow internal RC oscillator (128 kHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
3.17 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . . 66
3.18 On-chip peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
4.1 Package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . 85
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
1
Introduction
1.1
Document overview
2
3
This document describes the features of the family and
options available within the family members, and highlights
important electrical and physical characteristics of the device.
1.2
Description
This family of 32-bit system-on-chip (SoC) microcontrollers
is the latest achievement in integrated automotive application
controllers. It belongs to an expanding family of
automotive-focused products designed to address the next
wave of body electronics applications within the vehicle.
The advanced and cost-efficient e200z0 host processor core of
this automotive controller family complies with the Power
Architecture technology and only implements the VLE
®
(variable-length encoding) APU (Auxiliary Processor Unit),
providing improved code density. It operates at speeds of up
to 64 MHz and offers high performance processing optimized
for low power consumption. It capitalizes on the available
development infrastructure of current Power Architecture
devices and is supported with software drivers, operating
systems and configuration code to assist with users
implementations.
4
5
6
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
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