Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MCIMX35SR2AEC
Rev. 10, 06/2012
IMX35
Package Information
Plastic Package
Case 5284 17 x 17 mm, 0.8 mm Pitch
i.MX35 Applications
Processors for
Automotive Products
Ordering Information
See Table 1 on page 3 for ordering information.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1 Introduction
The i.MX35 Auto Application Processor family is
designed for automotive infotainment and navigation
applications. These processors are AECQ100 Grade 3
qualified and rated for ambient operating temperatures
up to 85 °C.
2
Functional Description and Application Information. . . . . . 4
2.1. Application Processor Domain Overview. . . . . . . . . 5
2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3. Advanced Power Management Overview . . . . . . . . 6
2.4. ARM11 Microprocessor Core. . . . . . . . . . . . . . . . . . 6
2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Signal Descriptions: Special Function Related Pins . . . . 12
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 13
4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 19
4.6. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 20
4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . . 21
4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . . 24
4.9. Module-Level AC Electrical Specifications. . . . . . . 30
5. Package Information and Pinout . . . . . . . . . . . . . . . . . . 131
5.1. MAPBGA Production Package 1568-01, 17 × 17 mm,
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Based on an ARM11 microprocessor core running at up
to 532 MHz, the device offers the following features and
optimized system cost for the target applications.
•
Audio connectivity and telematics:
— Compressed audio playback from storage
devices (CD, USB, HDD or SD card)
— PlayFromDevice (1-wire and 2-wire
support) for portable media players
— iPod/iPhone control and playback
— High-speed CD ripping to USB, SD/MMC
or HDD for virtual CD changer
5.2. MAPBGA Signal Assignments. . . . . . . . . . . . . . . 133
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . 145
7. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
— Audio processing for hands-free telephony:
Bluetooth, AEC/NS, and microphone beam
forming
— Speech recognition
© Freescale Semiconductor, Inc., 2010. All rights reserved.
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