90xxxx Series
Chip Capacitors
Rev. V2
Absolute Maximum Ratings2,3
Assembly Instructions
Die attach of the 90xxxx chip capacitors may be
accomplished with eutectic solder, such as Au 80 /
Sn 20, or conductive epoxy. Au wire or ribbon may
be bonded to the top contact using thermo
compression bonding or thermal sonic bonding. The
wire or ribbon should be attached at or near the
center of the top contact.
Parameter
Absolute Maximum
DC Reverse Voltage
Operating Temperature
Storage Temperature
50 V
-55°C to +150°C
-65°C to +200°C
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
3. MACOM does not recommend sustained operation near these
survivability limits.
Die Outline
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these Class 0 (HBM)
devices.
Dimensions are in inches
Die Dimensions
Dimensions (±0.002)
Model #
A & B
0.010
0.015
0.020
0.030
0.040
0.050
0.070
C
902R0 - 9010R
9011R - 9029R
9030R - 9049R
9050R - 9099R
90100 - 90199
90200 - 90399
90400 - 90600
0.005
0.005
0.006
0.006
0.008
0.008
0.008
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
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