Datasheet > 89-CBSAP-2.5X3.5X0.8

89-CBSAP-2.5X3.5X0.8

更新时间： 2022-12-07 07:06:11

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
29页	8644K
描述
89-CBSAP-2.5X3.5X0.8--89S14--CIR

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P a c k a g i n g a n d M a t e r i a l s

Standard Packaging

Optional Packaging

All Leader Tech products are packaged and shipped direct

from our Florida manufacturing facility. We hand pack all

items to ensure the greatest product quality and the most

economical shipping cost.

Leader Tech can accommodate virtually any packaging

request. Some of the most common packaging requests

include:

• Tape & Reel packaging

• Vacuum tray

• Customer-speciﬁed packaging

• Hand-packed foam liners with inner cardboard

reinforcement- at no extra charge

• Bar coding on every package, including customer part

number

Materials

Below is a list of the most common materials used by Leader Tech to manufacture standard, modiﬁed standard and custom

circuit board shields.

Tin Plated Steel

• Most cost effective option

Other Materials Upon Request

• Copper

• Most common material in PCB shielding

• Stocked thicknesses .008, .010, .012 & .015” (other

thickness available)

• Brass

• BeCu

• Stainless steel

• Bright tin and matte tin standard ﬁnish plating

• Highly solderable

Nickel Silver Alloy 770

• Copper based alloy

• Common material used in PCB components

• Stocked thicknesses .008”, .010”, .012” & .015”

• Highly solderable

• High corrosion resistance

Phosphorous Bronze

• Copper based alloy

• Non-magnetic applications

• Stocked thicknesses .010” & .015”

• Pre-tin plated and unplated available

Mu Metal

• For use in low frequency applications

• Non-magnetic applications

The Leading Edge in EMI Shielding Technology

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