TECHNICAL DATASHEET
ABLEBOND® 84-1LMISR4
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION
ABLEBOND® 84-1LMISR4 electrically conductive die
attach adhesive has been formulated for use in high
throughput, automatic die attach equipment. The rhe-
ology of ABLEBOND 84-1LMISR4 adhesive allows
minimum adhesive dispense and die put down dwell
times, without tailing or stringing problems. The unique
combination of adhesive properties makes this material
one the most widely used die attach materials in the
semiconductor industry.
FEATURES
• Excellent dispensability with minimal tailing and stringing
• Box oven cure
Test
Method
Typical Uncured Properties
Filler Type
ABLEBOND 84-1LMISR4
Test Description
Silver
8000 cP
5.6
Viscosity @ 25ºC
Thixotropic Index
Work Life @ 25ºC
Storage Life @ -40ºC
Brookfield CP51 @ 5 rpm
ATM-0018
ATM-0089
ATM-0067
ATM-0068
Viscosity @ 0.5/Viscosity @ 5 rpm
Physical worklife by % filler
18 hours
1 year
Test
Method
Cure Process Data
ABLEBOND 84-1LMISR4
Test Description
Weight Loss on Cure
5.3%
10 x 10 mm Si die on glass slide
ATM-0031
Recommended Cure Condition
Alternate Cure Condition (1)
1 hour @ 175ºC
3 - 5ºC / min ramp to 175ºC + 1 hour @ 175ºC
(1) The ramp was observed to yield reduced bondline voiding and increased strength
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary
based on customers’ experience and their application requirements, as well as customer curing equipment, oven
loading and actual oven temperatures.
PHYSIOCHEMICALPROPERTIES
- Post Cure
Test
Method
ABLEBOND 84-1LMISR4
Test Description
Ionics
Chloride
Sodium
Potassium
< 20 ppm
< 10 ppm
< 10 ppm
Teflon flask, 5 gm sample/20-40
mesh, 50 gm DI water, 100ºC for
24 hours
ATM-0007
Water Extract Conductivity
pH
13 µmhos/cm
Conductometer
ATM-0044
ATM-0002
ATM-0073
6
pH meter
Weight Loss @ 300ºC
0.35%
Thermogravimetric analysis
The figures shown above are typical values only. If you need to write a specification, please request our current
Standard Release Specification.
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