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84-1LMISR4 PDF预览

84-1LMISR4

更新时间: 2022-12-16 18:17:51
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
3页 387K
描述
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE

84-1LMISR4 数据手册

 浏览型号84-1LMISR4的Datasheet PDF文件第2页浏览型号84-1LMISR4的Datasheet PDF文件第3页 
TECHNICAL DATASHEET  
ABLEBOND® 84-1LMISR4  
ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE  
DESCRIPTION  
ABLEBOND® 84-1LMISR4 electrically conductive die  
attach adhesive has been formulated for use in high  
throughput, automatic die attach equipment. The rhe-  
ology of ABLEBOND 84-1LMISR4 adhesive allows  
minimum adhesive dispense and die put down dwell  
times, without tailing or stringing problems. The unique  
combination of adhesive properties makes this material  
one the most widely used die attach materials in the  
semiconductor industry.  
FEATURES  
• Excellent dispensability with minimal tailing and stringing  
• Box oven cure  
Test  
Method  
Typical Uncured Properties  
Filler Type  
ABLEBOND 84-1LMISR4  
Test Description  
Silver  
8000 cP  
5.6  
Viscosity @ 25ºC  
Thixotropic Index  
Work Life @ 25ºC  
Storage Life @ -40ºC  
Brookfield CP51 @ 5 rpm  
ATM-0018  
ATM-0089  
ATM-0067  
ATM-0068  
Viscosity @ 0.5/Viscosity @ 5 rpm  
Physical worklife by % filler  
18 hours  
1 year  
Test  
Method  
Cure Process Data  
ABLEBOND 84-1LMISR4  
Test Description  
Weight Loss on Cure  
5.3%  
10 x 10 mm Si die on glass slide  
ATM-0031  
Recommended Cure Condition  
Alternate Cure Condition (1)  
1 hour @ 175ºC  
3 - 5ºC / min ramp to 175ºC + 1 hour @ 175ºC  
(1) The ramp was observed to yield reduced bondline voiding and increased strength  
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary  
based on customers’ experience and their application requirements, as well as customer curing equipment, oven  
loading and actual oven temperatures.  
PHYSIOCHEMICALPROPERTIES  
- Post Cure  
Test  
Method  
ABLEBOND 84-1LMISR4  
Test Description  
Ionics  
Chloride  
Sodium  
Potassium  
< 20 ppm  
< 10 ppm  
< 10 ppm  
Teflon flask, 5 gm sample/20-40  
mesh, 50 gm DI water, 100ºC for  
24 hours  
ATM-0007  
Water Extract Conductivity  
pH  
13 µmhos/cm  
Conductometer  
ATM-0044  
ATM-0002  
ATM-0073  
6
pH meter  
Weight Loss @ 300ºC  
0.35%  
Thermogravimetric analysis  
The figures shown above are typical values only. If you need to write a specification, please request our current  
Standard Release Specification.  
Page 1 of 3  
07/05  

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