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80C196KB16 PDF预览

80C196KB16

更新时间: 2022-11-26 03:15:38
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
22页 1364K
描述
COMMERCIAL/EXPRESS CHMOS MICROCONTROLLER

80C196KB16 数据手册

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8XC196KB/8XC196KB16  
PIN DESCRIPTIONS  
Symbol  
Name and Function  
V
V
V
Main supply voltage (5V).  
Digital circuit ground (0V). There are multiple V pins, all of them must be connected.  
CC  
SS  
SS  
Reference voltage for the A/D converter (5V). V  
is also the supply voltage to the analog  
REF  
REF  
portion of the A/D converter and the logic used to read Port 0. Must be connected for A/D  
and Port 0 to function.  
ANGND  
Reference ground for the A/D converter. Must be held at nominally the same potential as  
V
SS  
. Connect V and ANGND at chip to avoid noise problems.  
SS  
V
Programming voltage. Also timing pin for the return from power down circuit.  
Input of the oscillator inverter and of the internal clock generator.  
Output of the oscillator inverter.  
PP  
XTAL1  
XTAL2  
CLKOUT  
Output of the internal clock generator. The frequency of CLKOUT is (/2 the oscillator  
frequency. It has a 50% duty cycle.  
RESET  
Reset input to and open-drain output from the chip. Input low for at least 4 state times to reset  
the chip. The subsequent low-to-high transition re-synchronizes CLKOUT and commences a  
10-state-time RESET sequence.  
BUSWIDTH Input for buswidth selection. If CCR bit 1 is a one, this pin selects the bus width for the bus  
cycle in progress. If BUSWIDTH is a 1, a 16-bit bus cycle occurs. If BUSWIDTH is a 0 an 8-bit  
cycle occurs. If CCR bit 1 is a 0, the bus is always an 8-bit bus.  
NMI  
A positive transition causes a vector through 203EH.  
INST  
Output high during an external memory read indicates the read is an instruction fetch and  
output low indicates a data fetch. INST is valid throughout the bus cycle. INST is activated  
only during external memory accesses.  
EA  
Input for memory select (External Access). EA equal to a TTL-high causes memory accesses  
to locations 2000H through 3FFFH to be directed to on-chip ROM/OTPR OM. EA equal to a  
TTL-low causes accesses to these locations to be directed to off-chip memory.  
ALE/ADV  
Address Latch Enable or Address Valid output, as selected by CCR. Both pin options provide  
a latch to demultiplex the address from the address/data bus. When the pin is ADV, it goes  
inactive high at the end of the bus cycle. ALE/ADV is activated only during external memory  
accesses.  
RD  
Read signal output to external memory. RD is activated only during external memory reads.  
WR/WRL  
Write and Write Low output to external memory, as selected by the CCR. WR will go low for  
every external write, while WRL will go low only for external writes where an even byte is  
being written. WR/WRL is activated only during external memory writes.  
BHE/WRH  
READY  
Bus High Enable or Write High output to external memory, as selected by the CCR. BHE will  
go low for external writes to the high byte of the data bus. WRH will go low for external writes  
where an odd byte is being addressed. BHE/WRH is activated only during external memory  
writes.  
Ready input to lengthen external memory cycles. If the pin is low prior to the falling edge of  
CLKOUT, the memory controller goes into a wait mode until the next positive transition in  
CLKOUT occurs with READY high. When the external memory is not being used, READY has  
no effect. Internal control of the number of wait states inserted into a bus cycle (held not  
ready) is available in the CCR.  
HSI  
Inputs to High Speed Input Unit. Four HSI pins are available: HSI.0, HSI.1, HSI.2 and HSI.3.  
Two of them (HSI.2 and HSI.3) are shared with the HSO Unit.  
HSO  
Outputs from High Speed Output Unit. Six HSO pins are available: HSO.0, HSO.1, HSO.2,  
HSO.3, HSO.4 and HSO.5. Two of them (HSO.4 and HSO.5) are shared with the HSI Unit.  
6

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