PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
5962-8002101VRA
5962-8002101VSA
80021012A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
W
FK
W
FK
J
20
20
20
20
20
20
20
20
20
1
None
None
None
None
None
None
None
None
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Call TI
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Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
1
LCCC
CFP
1
8002101SA
1
JM38510/32803B2A
JM38510/32803BRA
JM38510/32803BSA
SN54LS245J
LCCC
CDIP
CFP
1
1
W
J
1
CDIP
SSOP
1
SN74LS245DBR
DB
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74LS245DW
ACTIVE
ACTIVE
SOIC
SOIC
DW
DW
20
20
25
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74LS245DWR
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74LS245J
SN74LS245N
OBSOLETE
ACTIVE
CDIP
PDIP
J
20
20
None
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N
20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS245N3
OBSOLETE
ACTIVE
PDIP
SO
N
20
20
None
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SN74LS245NSR
NS
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SNJ54LS245FK
SNJ54LS245J
SNJ54LS245W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
20
20
1
1
1
None
None
None
Call TI
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
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