7MBP200XEN120-50
IGBT Modules
Thermal resistance characteristics (T C = 25℃)
■
Item
Symbol
R th(j-c)Q
R th(j-c)D
R th(j-c)Q
R th(j-c)D
R th(c-s)
Min. Typ. Max. Units
IGBT
-
-
-
-
-
-
0.143 K/W
0.224 K/W
0.237 K/W
0.395 K/W
Inverter
Brake
Thermal resistance
junction to case
*13
FWD
IGBT
FWD
-
-
-
0.05
-
K/W
Thermal resistance case to heat sink *14
*13: For 1 device ,the measurement point of the case is just under the chip.
*14: This is the value which is defined mounting on the additional heat sink with 1 W/(m·K) thermal grease.
Noise immunity (V DC=600V, V CC=15V)
■
Item
Conditions
Min. Typ. Max. Units
Common mode
rectangular noise
Pulse width 1μs,polarity ±,10min.
Judge:no over-current, no miss operating
±2.0
-
-
kV
Recommended operating conditions
■
Item
Symbol
V DC
V CC
f SW
t dead
-
Min. Typ. Max. Units
-
-
800
V
V
DC bus voltage
13.5 15.0 16.5
Power supply voltage of pre-driver
Switching frequency of IPM
Arm short through blocking time for IPM's input signal *15
Screw torque (M4)
-
-
-
-
20.0
-
3.5
kHz
μs
Nm
1.5
2.5
t
dead = t off - t d(on)
*15:
FM6M2053a
2023/03
4