78028-0126

更新时间： 2024-02-24 11:59:18

品牌	Logo	应用领域
莫仕 - MOLEX		连接器集管和边缘连接器 PC
页数	文件大小	规格书
2页	259K
描述
PCI Express* Connectors

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78028-0126 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	包装说明：	LEAD FREE
Reach Compliance Code：	unknown	风险等级：	5.76
连接器类型：	CARD EDGE CONNECTOR	联系完成配合：	GOLD (15)
联系完成终止：	TIN (15)	触点性别：	FEMALE
触点材料：	NOT SPECIFIED	DIN 符合性：	NO
滤波功能：	NO	IEC 符合性：	NO
JESD-609代码：	e3	MIL 符合性：	NO
混合触点：	NO	安装方式：	STRAIGHT
安装类型：	BOARD	装载的行数：	1
选件：	GENERAL PURPOSE	端接类型：	PRESS FIT
触点总数：	164	UL 易燃性代码：	94V-0
Base Number Matches：	1

78028-0126 数据手册

PCI Express* Connectors

FEATURES AND SPECIFICATIONS

Molex’s PCI Express* connector offers greater signaling bandwidths for

today’s workstation and server applications

78028

Vertical Press fit

PCI Express is a third generation I/O architecture. PCI-SIG* recently

updated PCI Express specifications to greater signaling bandwidth. Unlike

the previous version in which the PCI bus is implemented via a multi-drop

parallel architecture, PCI Express now incorporates a point-to-point

signaling using differential pairs operating at 2.5 Gbps. PCI Express

provides adequate bandwidth to support developing I/O such as

Infiniband and 10G fiber channel.

Molex’s press fit version of PCI Express provides an alternative for

customers who require solderless termination on PCBs which have a high

layer count.

All Molex PCI Express connectors are compliant with PCI-SIG*

specifications. For more information on these specifications please see

www.pcisig.com

Features and Benefits

High-temperature thermoplastic housing for lead-free processing Complies with PCI-SIG industry specifications ensure connectors

support all PCI Express module cards available in the market

Ridge design will be compatible with module cards that require a

retention clip for secure retention

Keying design ensures correct mating of card module to edge card

connector

Press fit termination allows solderless termination on high layer

count PCBs

SPECIFICATIONS

Reference Information

Packaging: Tray

Mechanical

Max Terminal Retention Force: 2.94 N min/Terminal

Mating Force: 1.15 N max/contact pair

Un-Mating Force: 0.15 N min/contact pair

Durability: 50 Cycles

UL File No.: Pending

CSA File No.: Pending

Mates With : PCI Express^®*module card

Designed In: mm

Physical

Electrical

Voltage: 50 Volts AC (RMS)/DC

Current: 1.1 Amps/pin

Contact Resistance: 30 milliohms max

Dielectric Withstanding Voltage: 500V AC

Insulation Resistance: 1000 Megohms min

Housing: High Temperature Nylon, Black, UL 94V-0

Contact: Copper Alloy

Plating:

Contact Area —0.76 µm Gold or 0.38 µm Gold

Solder Tail Area — Tin

Underplating — Nickel

PCB Thickness: See Ordering Tables

Operating Temperature: - 55 ºC to +85 ºC

*PCI Express, ExpressModule, and PCI-SIG are trademarks of PIC-SIG

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