1.90 by 1.35mm
(.075” by .053”) Pitch
ImpactTM
FEATURES AND SPECIFICATIONS
Backplane Connector System
4 Pair
Molex’s Impact backplane connector system pushes the speed and density envelope to meet the
growing demands of next generation telecommunication and data networking equipment
The Impact backplane connector system provides data
rates over 20 Gbps and superior signal density up to
80 differential pairs per inch. The Impact System’s
broad-edge-coupled technology enables low cross-talk
and high signal bandwidth while minimizing channel
performance variation across every differential pair
within the system.
performance and built-in ground-signal sequencing.
This reduces the average mating force per connector
to improve the mechanical mating performance of
the system.
76155 Backplane
Signal Headers
76160 Daughtercard
Connectors
The Impact backplane connector system is designed for
traditional backplane and/or midplane architectures
to meet the growing demands of next-generation
telecommunication and data networking equipment
Molex’s Impact System offers multiple compliant-pin
design options on both the daughtercard and backplane manufacturers. The Impact connector system is offered
connectors, providing customers ultimate flexibility
to optimize their designs for superior mechanical and
electrical performance. The Impact system’s mating
in 3-, 4-, 5- and 6-pair versions, with a complete range
of guidance and power-solution options. For more
information on Molex’s Impact backplane connector
interface provides inline-staggered, bifurcated contacts system, contact impact@molex.com
that provide 2 points of contact for long-term reliability
Features and Benefits
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Data rates over 20 Gbps support future system
performance upgrades
PCB routing flexibility provides simple 1.90 by
1.35mm (.075 by .053”) grid on both backplane
and daughtercard reduces PCB routing complexity
and costs
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Broad-edge-coupled, differential-pair system for
superior density, low cross-talk, low insertion loss
and minimal performance variation across all high-
speed channels
Impact 4 Pair by 10 Column Red Card Demo
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Two compliant-pin attach options provide customers
ultimate flexibility to optimize their designs for
superior mechanical and electrical performance
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n
Differential pair density up to 80 pairs per
linear inch provides the highest speed, highest
differential pair density per square inch in the
industry
Inline staggered, bifurcated contact beams in
daughtercard interface for superior mating
performance with two points of contact for
long-term reliability and built-in ground-signal
sequencing
IEEE 10GBASE-KR and Optical Internetworking
Forum (OIF) Stat Eye Compliant channel
performance demonstrates end-to-end channel
performance compliance
SPECIFICATIONS
Reference Information
Packaging: Trays
Mechanical
Contact Insertion Force:
UL File No.: Pending
CSA File No.: Pending
Designed In: Millimeters
35.6N (8 lb) per contact.
Contact Retention Force:
4.45N (1.0 lb) min. per contact
Mating Force: 0.69N (0.15 lb) max. per contact
Durability: 200 cycles
Electrical
Signal Contact Current Rating: 1.0A
Contact to Plated Through-Hole Resistance:
1.0 milliohm max.
Dielectric Withstanding Voltage: 750V RMS
Insulation Resistance: 10,000 Megohms min.
Physical
Housing: Liquid Crystal Polymer, UL 94V-0
Contact: High Performance Copper (Cu) Alloy
Plating:
Impact 4 Pair by 10 Column Guide Left
Contact Area — 0.76µm (30µ”) Gold (Au) min.
Termination Area — Tin (Sn) or Tin/Lead (Sn/Pb)
Underplating – Nickel (Ni)
PCB Thickness: 1.60mm (.062”) typical
Operating Temperature: -55 to +85°C max.
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