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73S1215F-44IMR/F PDF预览

73S1215F-44IMR/F

更新时间: 2024-01-05 07:06:53
品牌 Logo 应用领域
TERIDIAN 多功能外围设备微控制器和处理器时钟
页数 文件大小 规格书
136页 1028K
描述
80515 System-on-Chip with USB, ISO 7816 / EMV, PINpad and More

73S1215F-44IMR/F 技术参数

生命周期:Transferred包装说明:LEAD FREE, QFN-44
Reach Compliance Code:unknown风险等级:5.74
Is Samacsys:N其他特性:OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED
地址总线宽度:边界扫描:NO
总线兼容性:I2C; USB最大时钟频率:12 MHz
外部数据总线宽度:JESD-30 代码:S-XQCC-N44
长度:7 mm端子数量:44
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
认证状态:Not QualifiedRAM(字数):2000
座面最大高度:0.85 mm最大供电电压:3.6 V
最小供电电压:2.7 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
宽度:7 mmBase Number Matches:1

73S1215F-44IMR/F 数据手册

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73S1215F Data Sheet  
DS_1215F_003  
© 2008 Teridian Semiconductor Corporation. All rights reserved.  
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.  
Windows is a registered trademark of Microsoft Corporation.  
Signum Systems is a trademark of Signum Systems Corporation.  
ExpressCard is a registered trademarks of PCMCIA.  
All other trademarks are the property of their respective owners.  
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly  
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms  
and Conditions. The company assumes no responsibility for any errors which may appear in this  
document, reserves the right to change devices or specifications detailed herein at any time without  
notice and does not make any commitment to update the information contained herein. Accordingly, the  
reader is cautioned to verify that this document is current by comparing it to the latest version on  
http://www.teridian.com or by checking with your sales representative.  
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618  
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com  
136  
Rev. 1.4  

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