Datasheet > 71V3557SA80BGI

71V3557SA80BGI

更新时间： 2024-01-11 03:31:54

品牌	Logo	应用领域
艾迪悌 - IDT		时钟静态存储器内存集成电路
页数	文件大小	规格书
28页	512K
描述
ZBT SRAM, 128KX36, 8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

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技术参数
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71V3557SA80BGI 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	14 X 22 MM, PLASTIC, BGA-119
针数：	119	Reach Compliance Code：	not_compliant
ECCN代码：	3A991.B.2.A	HTS代码：	8542.32.00.41
风险等级：	5.28	最长访问时间：	8 ns
其他特性：	FLOW-THROUGH ARCHITECTURE	最大时钟频率 (fCLK)：	95 MHz
I/O 类型：	COMMON	JESD-30 代码：	R-PBGA-B119
JESD-609代码：	e0	长度：	22 mm
内存密度：	4718592 bit	内存集成电路类型：	ZBT SRAM
内存宽度：	36	湿度敏感等级：	3
功能数量：	1	端子数量：	119
字数：	131072 words	字数代码：	128000
工作模式：	SYNCHRONOUS	最高工作温度：	85 °C
最低工作温度：	-40 °C	组织：	128KX36
输出特性：	3-STATE	封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装等效代码：	BGA119,7X17,50
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY
并行/串行：	PARALLEL	峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	3.3 V	认证状态：	Not Qualified
座面最大高度：	2.36 mm	最大待机电流：	0.045 A
最小待机电流：	3.14 V	子类别：	SRAMs
最大压摆率：	0.26 mA	最大供电电压 (Vsup)：	3.465 V
最小供电电压 (Vsup)：	3.135 V	标称供电电压 (Vsup)：	3.3 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	Tin/Lead (Sn63Pb37)
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	14 mm	Base Number Matches：	1

71V3557SA80BGI 数据手册

128K x 36, 256K x 18,

IDT71V3557S

IDT71V3559S

IDT71V3557SA

IDT71V3559SA

3.3V Synchronous ZBT™ SRAMs

3.3V I/O, Burst Counter,

Flow-Through Outputs

Features

it read or write.

◆

128K x 36, 256K x 18 memory configurations

Supports high performance system speed - 100 MHz

(7.5 ns Clock-to-Data Access)

The IDT71V3557/59 contain address, data-in and control signal

registers.Theoutputsareflow-through(nooutputdataregister).Output

enable is the only asynchronous signal and can be used to disable the

outputsatanygiventime.

A Clock Enable (CEN) pin allows operation of the IDT71V3557/59

to be suspended as long as necessary. All synchronous inputs are

ignored when (CEN) is high and the internal device registers will hold

their previous values.

Therearethreechipenablepins(CE1,CE2,CE2)thatallowtheuser

todeselectthedevicewhendesired.Ifanyoneofthesethreeisnotasserted

when ADV/LD is low, no new memory operation can be

initiated. However, any pending data transfers (reads or writes) will

be completed. The data bus will tri-state one cycle after chip is de-

selectedorawriteisinitiated.

The IDT71V3557/59 have an on-chip burst counter. In the burst

mode, the IDT71V3557/59 can provide four cycles of data for a single

address presented to the SRAM. The order of the burst sequence is

defined by the LBO input pin. The LBO pin selects between linear and

interleaved burst sequence. The ADV/LD signal is used to load a new

externaladdress(ADV/LD=LOW)orincrementtheinternalburstcounter

(ADV/LD = HIGH).

◆

ZBT^TMFeature - No dead cycles between write and read

cycles

Internally synchronized output buffer enable eliminates

the need to control OE

◆

Single R/W (READ/WRITE) control pin

4-word burst capability (Interleaved or linear)

Individual byte write (BW1 - BW4) control (May tie active)

Three chip enables for simple depth expansion

3.3V power supply (±5%), 3.3V (±5%) I/O Supply (VDDQ)

Optional Boundary Scan JTAG Interface (IEEE 1149.1

complaint)

Packaged in a JEDEC Standard 100-pin plastic thin quad

flatpack (TQFP), 119 ball grid array (BGA) and 165 fine

pitch ball grid array (fBGA)

◆

Description

TheIDT71V3557/59are3.3Vhigh-speed4,718,592-bit(4.5Mega-

bit)synchronous SRAMs organizedas 128Kx36/256Kx18. Theyare

designed to eliminate dead bus cycles when turning the bus around

between reads and writes, or writes and reads. Thus they have been

The IDT71V3557/59 SRAMs utilize IDT's latest high-performance

CMOSprocessandarepackagedinaJEDECstandard14mmx20mm

100-pin thinplasticquadflatpack(TQFP)aswellasa119 ballgridarray

(BGA) and a 165 fine pitch ball grid array (fBGA).

given the name ZBT , or Zero Bus Turnaround.

AddressandcontrolsignalsareappliedtotheSRAMduringoneclock

cycle,andonthenextclockcycletheassociateddatacycleoccurs,be

PinDescriptionSummary

A0-A17

Address Inputs

Input

Output

Input

I/O

Synchronous

Asynchronous

Synchronous

N/A

Chip Enables

CE¹, CE², CE²

Output Enable

R/W

Read/Write Signal

Clock Enable

CEN

Individual Byte Write Selects

Clock

BW¹, BW², BW³, BW⁴

CLK

ADV/LD

LBO

Advance burst address / Load new address

Linear / Interleaved Burst Order

Test Mode Select

Test Data Input

Synchronous

Static

TMS

TDI

Synchronous

N/A

TCK

TDO

Test Clock

Test Data Output

Synchronous

Asynchronous

Synchronous

Static

JTAG Reset (Optional)

Sleep Mode

TRST

I/O⁰-I/O³¹, I/O^P1-I/O^P4

V^DD, V^DDQ

Data Input / Output

Core Power, I/O Power

Ground

Supply

V^SS

Static

5282 tbl 01

MAY 2002

DSC-5282/06

12 3 4 5 6 7...28

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与71V3557SA80BGI相关器件

型号	品牌	描述	获取价格	数据表
71V3557SA80BGI8	IDT	ZBT SRAM, 128KX36, 8ns, CMOS, PBGA119, 14 X 22 MM, POWER, PLASTIC, BGA-119	获取价格
71V3557SA80BQ	IDT	ZBT SRAM, 128KX36, 8ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165	获取价格
71V3557SA80BQGI8	IDT	SRAM	获取价格
71V3557SA80BQI8	IDT	SRAM	获取价格
71V3557SA80PFGI	IDT	Cache SRAM, 128KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100	获取价格
71V3557SA85BGI	IDT	ZBT SRAM, 128KX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119	获取价格

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