71V3556S
71V3558S
71V3556SA
71V3558SA
128K x 36, 256K x 18
3.3V Synchronous ZBT SRAMs
3.3V I/O, Burst Counter
Pipelined Outputs
Features
◆
◆
4-word burst capability (interleaved or linear)
128K x 36, 256K x 18 memory configurations
◆
◆
◆
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Individual byte write (BW1 - BW4) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%), 3.3V I/O Supply (VDDQ)
Optional- Boundary Scan JTAG Interface (IEEE 1149.1
compliant)
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
Supports high performance system speed - 166 MHz (x36)
(3.5 ns Clock-to-Data Access)
ZBTTM Feature - No dead cycles between write and read
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cycles
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Internally synchronized output buffer enable eliminates the
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need to control OE
Positive clock-edge triggered address, data, and control
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signal registers for fully pipelined applications
Positive clock-edge triggered address, data, and control
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Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
signal registers for fully pipelined applications
Single R/W (READ/WRITE) control pin
◆
Functional Block Diagram
128Kx36 BIT
MEMORY ARRAY
LBO
Address A [0:16]
D
D
Q
Q
Address
CE1,CE2, CE2
R/W
Control
CEN
ADV/LD
BW/x
DI
DO
D
Q
Control Logic
Clk
Mux
Sel
D
Output Register
Q
Clock
Gate
OE
5281 drw 01a
,
TMS
TDI
TCK
Data I/O [0:31],
I/O P[1:4]
JTAG
(SA Version)
TDO
TRST
(optional)
ZBT®andZeroBusTurnaroundaretrademarksofRenesasandthearchitectureissupportedbyMicronTechnologyandMotorolaInc.
1
Aug.06.21