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6MBP30XSF060-50 PDF预览

6MBP30XSF060-50

更新时间: 2024-04-09 18:58:51
品牌 Logo 应用领域
富士电机 - FUJI
页数 文件大小 规格书
18页 1855K
描述
IPM(Inv.+Gate Driver) P633A

6MBP30XSF060-50 数据手册

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6MBP30XSF060-50  
IGBT Modules  
Thermal characteristic(T =25)  
C
Description  
Symbol  
min.  
-
Unit  
typ.  
-
max  
Junction to case thermal resistance (per single IGBT)  
R th(j-c)_IGBT  
2.20  
3.45  
/W  
/W  
Note*13  
Junction to case thermal resistance (per single FWD)  
Note*13  
R th(j-c)_FWD  
-
-
Mechanical characteristics(T =25)  
C
Description  
Symbol  
Conditions  
min.  
0.59  
Unit  
Nm  
typ.  
0.69  
max  
0.98  
M S  
Mounting torque of screws  
Mounting screw : M3  
The AL-IMS part:  
-50  
-
100  
See (A1),(A2) of Fig.1-2 and Fig.1-3  
The resin case part:  
Heat-sink side flatness  
-
m  
-200  
-
-
0
-
See (B1),(B2) of Fig.1-2 and Fig.1-3  
-
9.3  
g
-
Weight  
Solder temp : 260 ±5℃  
Immersion time : 10±1s  
Solder alloy : Sn-Ag-Cu type  
Resistance to soldering heat  
-
-
1
time  
-
1698i  
2022/05  
6

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