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5962R1320202V9A PDF预览

5962R1320202V9A

更新时间: 2024-01-01 09:32:50
品牌 Logo 应用领域
德州仪器 - TI 输出元件稳压器调节器
页数 文件大小 规格书
32页 2100K
描述
耐辐射 QMLV、1.5V 至 7V 输入、3A 低噪声可调低压降 (LDO) 稳压器 | KGD | 0 | -55 to 125

5962R1320202V9A 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:DIE-25
Reach Compliance Code:compliantFactory Lead Time:12 weeks
风险等级:5.68可调性:ADJUSTABLE
标称回动电压 1:0.21 V最大输入电压:7 V
最小输入电压:1.5 VJESD-30 代码:R-XUUC-N25
功能数量:1输出次数:1
端子数量:25工作温度TJ-Max:125 °C
工作温度TJ-Min:-55 °C最大输出电流 1:3 A
最大输出电压 1:6.65 V最小输出电压 1:0.8 V
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Qualified
调节器类型:ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR筛选级别:MIL-PRF-38535 Class V
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
总剂量:100k Rad(Si) VBase Number Matches:1

5962R1320202V9A 数据手册

 浏览型号5962R1320202V9A的Datasheet PDF文件第1页浏览型号5962R1320202V9A的Datasheet PDF文件第3页浏览型号5962R1320202V9A的Datasheet PDF文件第4页浏览型号5962R1320202V9A的Datasheet PDF文件第5页浏览型号5962R1320202V9A的Datasheet PDF文件第6页浏览型号5962R1320202V9A的Datasheet PDF文件第7页 
TPS7H1101A-SP  
SLVSDW6C – APRIL 2017 – REVISED APRIL 2021  
www.ti.com  
Table of Contents  
1 Features............................................................................1  
2 Applications.....................................................................1  
3 Description.......................................................................1  
4 Revision History.............................................................. 2  
5 Pin Configuration and Functions...................................3  
6 Specifications.................................................................. 6  
6.1 Absolute Maximum Ratings........................................ 6  
6.2 ESD Ratings............................................................... 6  
6.3 Recommended Operating Conditions.........................6  
6.4 Thermal Information....................................................6  
6.5 Electrical Characteristics.............................................7  
6.6 Typical Characteristics..............................................10  
7 Detailed Description......................................................12  
7.1 Overview...................................................................12  
7.2 Functional Block Diagram.........................................12  
7.3 Feature Description...................................................13  
7.4 Device Functional Modes..........................................13  
8 Application and Implementation..................................14  
8.1 Application Information............................................. 14  
8.2 Typical Application.................................................... 15  
9 Power Supply Recommendations................................26  
10 Layout...........................................................................26  
10.1 Layout Guidelines................................................... 26  
10.2 Layout Example...................................................... 26  
11 Device and Documentation Support..........................27  
11.1 Device Support........................................................27  
11.2 Documentation Support.......................................... 27  
11.3 Receiving Notification of Documentation Updates..27  
11.4 Support Resources................................................. 27  
11.5 Trademarks............................................................. 27  
11.6 Electrostatic Discharge Caution..............................27  
11.7 Glossary..................................................................27  
12 Mechanical, Packaging, and Orderable  
Information.................................................................... 27  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision B (June 2020) to Revision C (April 2021)  
Page  
Updated the numbering format for tables, figures, and cross-references throughout the document..................1  
Added TPS7H1101AHKR/EM to Device Information table.................................................................................1  
Changes from Revision A (August 2017) to Revision B (June 2020)  
Page  
Added package weight to Device Information table............................................................................................1  
Added note to Pin Functions table for thermal pad and lid.................................................................................3  
Added updated thermal metrics in Thermal Information table............................................................................6  
Changed and relaxed VCS operating range........................................................................................................7  
Added table note for VCS ................................................................................................................................... 7  
Changed CSR ratio. Added limits by temperature .............................................................................................7  
Added clarification for TEN ................................................................................................................................. 7  
Changed Overview section for improved clarity .............................................................................................. 12  
Changed and clarifed VREF voltage in CSS calculation .................................................................................... 13  
Changed Stability applications section............................................................................................................. 14  
Changed and corrected PCL section description............................................................................................. 16  
Changed and clarified High-Side Current Sense section description ..............................................................17  
Changed and clarified Current Foldback section description........................................................................... 19  
Changed and improved Layout Example section............................................................................................. 26  
Changes from Revision * (April 2017) to Revision A (August 2017)  
Page  
Added Bare Die Information table.......................................................................................................................3  
Added Bond Pad Coordinates in Microns table..................................................................................................3  
Copyright © 2021 Texas Instruments Incorporated  
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Product Folder Links: TPS7H1101A-SP  
 

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