Datasheet > 5962F9683201VCA

5962F9683201VCA

更新时间： 2024-02-28 14:22:34

品牌	Logo	应用领域
瑞萨 - RENESAS		放大器
页数	文件大小	规格书
4页	43K
描述
DUAL OP-AMP, CDIP14

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技术参数
数据手册

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5962F9683201VCA 技术参数

生命周期：	Obsolete	零件包装代码：	DIP
包装说明：	DIP,	针数：	14
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8542.33.00.01	风险等级：	5.83
放大器类型：	OPERATIONAL AMPLIFIER	JESD-609代码：	e0
长度：	19.43 mm	标称负供电电压 (Vsup)：	-5 V
功能数量：	2	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP	封装形式：	IN-LINE
认证状态：	Not Qualified	座面最大高度：	5.08 mm
标称压摆率：	1050 V/us	子类别：	Operational Amplifier
标称供电电压 (Vsup)：	5 V	表面贴装：	NO
技术：	BIPOLAR	温度等级：	MILITARY
端子面层：	TIN LEAD	端子形式：	THROUGH-HOLE
端子节距：	2.54 mm	端子位置：	DUAL
总剂量：	300k Rad(Si) V	宽度：	7.62 mm

5962F9683201VCA 数据手册

HS-1245RH

Die Characteristics

DIE DIMENSIONS:

ASSEMBLY RELATED INFORMATION:

69 mils x 92 mils x 19 mils ±1 mil

1750 x 2330 x 355µm ±25.4µm

Substrate Potential (Powered Up):

Floating

INTERFACE MATERIALS:

Glassivation:

ADDITIONAL INFORMATION:

Worst Case Current Density:

Type: Nitride

Thickness: 4kÅ ±0.5kÅ

< 2 x 10 A/cm

Top Metallization:

Transistor Count:

Type: Metal 1: AICu(2%)/TiW

Type: Metal 2: AICu(2%)

150

Thickness: Metal 1: 8kÅ ±0.4kÅ

Thickness: Metal 2: 16kÅ ±0.8kÅ

Substrate:

UHF-1X, Bonded Wafer, DI

Backside Finish:

Silicon

Metallization Mask Layout

HS-1245RH

OUT1

-IN1

GND (NOTE)

V+

+IN1

DISABLE1

V-

DISABLE2

OUT2

+IN2

V-

-IN2

NOTE: This is an optional GND pad. Users may set a GND reference, via this pad, to ensure the TTL compatibility of the DISABLE inputs when

using asymmetrical supplies (e.g., V+ = 10V, V- = 0V). See the “Application Information” section for details.

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiﬁcation.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-

out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

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