1.3 Absolute maximum ratings. 1/
Supply voltage between +V and -V ............................................................................ 40 V
Supply voltage between +V and ground..................................................................... +20 V
Supply voltage between -V and ground...................................................................... -20 V
Digital input overvoltage:
+V , +V ............................................................................................................. +V
+ 4 V
- 4 V
EN
A
SUPPLY
-V , -V .............................................................................................................. -V
EN
A
SUPPLY
Analog input overvoltage:
+V ........................................................................................................................ +V
+20 V
-20 V
S
SUPPLY
-V ........................................................................................................................ -V
S
SUPPLY
Peak current, S or D (pulsed at 1 ms, 10 percent duty cycle max)............................. 40 mA
Storage temperature range ........................................................................................ -65 C to +150 C
Maximum package power dissipation at T = +125 C (P ): 2/
A
D
Case outline E......................................................................................................... 0.67 W
Case outline X......................................................................................................... 0.59 W
Thermal resistance, junction-to-case (
):
JC
Case outline E......................................................................................................... 12 C/W
Case outline X......................................................................................................... 25 C/W
Thermal resistance, junction-to-ambient (
):
JA
Case outline E......................................................................................................... 75 C/W
Case outline X......................................................................................................... 85 C/W
Lead temperature (soldering, 10 seconds)................................................................. +275 C
Junction temperature (T )........................................................................................... +175 C
J
1.4 Recommended operating conditions.
Operating supply voltage ( V )........................................................................ 15 V
SUPPLY
Logic low level (V )................................................................................................... +0.8 V
AL
Logic high level (V )................................................................................................. +4.0 V
AH
Ambient operating temperature range (T ) ................................................................ -55 C to +125 C
A
1.5 Radiation features
SEP effective let no upset:
Device type 01 ........................................................................................................ 110 MEV/(cm2 / mg) 3/
Device type 02 ........................................................................................................ TBD
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s)
Device classes Q and V:
Device type 01 ................................................................................................... 100 Krad (Si)
Device type 02 ................................................................................................... 300 Krad (Si)
Device type class T:
Device type 01 and 02 ....................................................................................... 100 Krad (Si)
Dose rate upset (20 ns pulse):
Device type 01 ........................................................................................................ >1 x 108 Rad(Si)/s
Device type 02 ........................................................................................................ Not tested
Latch-up...................................................................................................................... None 3/
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ If device power exceeds package dissipation capability, provide heat sinking or derate linearly (the derating is based on
) at the following rates:
JA
Case outline E.............................................................................13.3 mW/ C
Case outline X.............................................................................11.76 mW/ C
3/ Guaranteed by process or design, not tested.
SIZE
STANDARD
5962-96742
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
E
3
DSCC FORM 2234
APR 97
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