Datasheet > 5962F9666302V9A

5962F9666302V9A

更新时间： 2024-02-18 21:05:31

品牌	Logo	应用领域
英特矽尔 - INTERSIL		驱动器接口集成电路
页数	文件大小	规格书
2页	36K
描述
Radiation Hardened 3.3V Quad Differential Line Driver

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技术参数
数据手册

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5962F9666302V9A 技术参数

生命周期：	Active	零件包装代码：	DIE
包装说明：	DIE,	针数：	16
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.73
差分输出：	YES	驱动器位数：	4
输入特性：	STANDARD	接口集成电路类型：	LINE DRIVER
接口标准：	EIA-422	JESD-30 代码：	R-XUUC-N16
JESD-609代码：	e0	功能数量：	4
端子数量：	16	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装主体材料：	UNSPECIFIED
封装代码：	DIE	封装形状：	RECTANGULAR
封装形式：	UNCASED CHIP	认证状态：	Qualified
筛选级别：	MIL-PRF-38535 Class V	最大供电电压：	3.6 V
最小供电电压：	3 V	标称供电电压：	3.3 V
表面贴装：	YES	技术：	CMOS
温度等级：	MILITARY	端子面层：	TIN LEAD
端子形式：	NO LEAD	端子位置：	UPPER
总剂量：	300k Rad(Si) V	最大传输延迟：	42 ns
Base Number Matches：	1

5962F9666302V9A 数据手册

HS-26CLV31RH

Die Characteristics

DIE DIMENSIONS:

96.5 mils x 195 mils x 21 mils

(2450 x 4950)

Substrate:

AVLSI1RA

Backside Finish:

INTERFACE MATERIALS:

Silicon

Glassivation:

ASSEMBLY RELATED INFORMATION:

Substrate Potential (Powered Up):

Type: PSG (Phosphorus Silicon Glass)

Thickness: 8kÅ ± 1kÅ

Metallization:

ADDITIONAL INFORMATION:

Worst Case Current Density:

Bottom: Mo/TiW

Thickness: 5800Å ± 1kÅ

Top: AlSiCu (Top)

Thickness: 10kÅ ± 1kÅ

<2.0 x 10 A/cm

Bond Pad Size:

110µm x 100µm

Metallization Mask Layout

HS-26CLV31RH

AO (2)

(14) DO

AO (3)

(13) DO

ENABLE (4)

(12) ENABLE

BO (5)

(11) CO

BO (6)

(10) CO

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiﬁcation.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-

out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site www.intersil.com

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