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5962-9958501QXC PDF预览

5962-9958501QXC

更新时间: 2024-02-14 19:59:13
品牌 Logo 应用领域
ACTEL 可编程逻辑
页数 文件大小 规格书
217页 1554K
描述
Field Programmable Gate Array, 36000 Gates, 2414-Cell, CMOS, CQFP256, CERAMIC, QFP-256

5962-9958501QXC 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:CERAMIC, QFP-256Reach Compliance Code:compliant
ECCN代码:3A001.A.2.CHTS代码:8542.39.00.01
风险等级:5.81其他特性:ALSO OPERATES AT 5V SUPPLY
JESD-30 代码:S-CQFP-F256长度:36 mm
等效关口数量:36000端子数量:256
最高工作温度:125 °C最低工作温度:-55 °C
组织:36000 GATES封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:GQFF封装形状:SQUARE
封装形式:FLATPACK, GUARD RING峰值回流温度(摄氏度):NOT SPECIFIED
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Qualified
筛选级别:MIL-PRF-38535 Class Q座面最大高度:3.18 mm
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:36 mmBase Number Matches:1

5962-9958501QXC 数据手册

 浏览型号5962-9958501QXC的Datasheet PDF文件第1页浏览型号5962-9958501QXC的Datasheet PDF文件第3页浏览型号5962-9958501QXC的Datasheet PDF文件第4页浏览型号5962-9958501QXC的Datasheet PDF文件第5页浏览型号5962-9958501QXC的Datasheet PDF文件第6页浏览型号5962-9958501QXC的Datasheet PDF文件第7页 
MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
1 SCOPE ......................................................................................................................................................................1  
1.1 Scope......................................................................................................................................................................1  
2. APPLICABLE DOCUMENTS ....................................................................................................................................1  
2.1 General ...................................................................................................................................................................1  
2.2 Government documents..........................................................................................................................................2  
2.2.1 Specifications, standards, and handbooks...........................................................................................................2  
2.2.2 Other Government documents, drawings, and publications.................................................................................2  
2.3 Non-Government publications.................................................................................................................................2  
2.4 Order of precedence ...............................................................................................................................................3  
3. REQUIREMENTS .....................................................................................................................................................3  
3.1 General ...................................................................................................................................................................3  
3.1.1 Reference to applicable device specification........................................................................................................3  
3.2 Item requirements ...................................................................................................................................................3  
3.2.1 Certification of conformance and acquisition traceability......................................................................................4  
3.3 Quality management (QM) program........................................................................................................................5  
3.3.1 Manufacturer's review system..............................................................................................................................5  
3.3.2 QM plan................................................................................................................................................................5  
3.3.3 Self-assessment program ....................................................................................................................................5  
3.3.4 Change control procedures..................................................................................................................................5  
3.3.4.1 Discontinuation of products...............................................................................................................................5  
3.4 Requirements for listing on a QML..........................................................................................................................5  
3.4.1 QML certification requirements ............................................................................................................................6  
3.4.1.1 Process capability demonstration......................................................................................................................6  
3.4.1.1.1 New technology insertion...............................................................................................................................6  
3.4.1.2 Management and technology validation............................................................................................................7  
3.4.1.3 On-site validation ..............................................................................................................................................7  
3.4.1.3.1 Second and third party validations .................................................................................................................7  
3.4.1.3.2 Radiation source of supply (RSS) validations ................................................................................................7  
3.4.1.4 Technology validation .......................................................................................................................................7  
3.4.1.4.1 Package design selection reviews .................................................................................................................8  
3.4.1.5 Manufacturer self-validation ..............................................................................................................................9  
3.4.1.6 Change management system ...........................................................................................................................9  
3.4.1.7 Deficiencies and concerns ................................................................................................................................9  
3.4.1.8 Letter of certification..........................................................................................................................................9  
3.4.2 QML qualification requirements............................................................................................................................9  
3.4.2.1 Qualification extension......................................................................................................................................9  
3.4.3 Qualification to RHA levels.................................................................................................................................10  
3.4.4 QML listing.........................................................................................................................................................10  
3.4.5 Maintenance and retention of QML....................................................................................................................10  
3.4.6 QML line shutdown ............................................................................................................................................10  
3.4.7 Revalidation reviews ..........................................................................................................................................10  
3.4.8 Performance requirements for class T devices ..................................................................................................10  
3.4.8.1 Class T radiation requirements .......................................................................................................................11  
3.5 Device specification ..............................................................................................................................................11  
3.6 Marking of microcircuits ........................................................................................................................................11  
3.6.1 Index point..........................................................................................................................................................11  
3.6.2 Part or identification number (PIN).....................................................................................................................12  
3.6.2.1 RHA designator...............................................................................................................................................13  
3.6.2.2 Drawing designator .........................................................................................................................................13  
3.6.2.2.1 Military designator........................................................................................................................................13  
3.6.2.3 Device class designator ..................................................................................................................................13  
3.6.2.4 Case outline ....................................................................................................................................................13  
3.6.2.5 Lead finish.......................................................................................................................................................13  
3.6.3 Certification mark ...............................................................................................................................................13  
3.6.3.1 QD certification mark.......................................................................................................................................13  
ii  

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