5秒后页面跳转
5962-9669105HYX PDF预览

5962-9669105HYX

更新时间: 2024-01-12 02:06:37
品牌 Logo 应用领域
美高森美 - MICROSEMI 静态存储器内存集成电路
页数 文件大小 规格书
11页 1068K
描述
Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32

5962-9669105HYX 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP-32针数:32
Reach Compliance Code:compliantECCN代码:3A001.A.2.C
HTS代码:8542.32.00.41风险等级:5.04
Is Samacsys:N最长访问时间:55 ns
JESD-30 代码:R-XDIP-T32JESD-609代码:e4
长度:41.91 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:32
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:128KX8
封装主体材料:UNSPECIFIED封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:5.1 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:PALLADIUM GOLD
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:15.24 mm
Base Number Matches:1

5962-9669105HYX 数据手册

 浏览型号5962-9669105HYX的Datasheet PDF文件第1页浏览型号5962-9669105HYX的Datasheet PDF文件第3页浏览型号5962-9669105HYX的Datasheet PDF文件第4页浏览型号5962-9669105HYX的Datasheet PDF文件第5页浏览型号5962-9669105HYX的Datasheet PDF文件第6页浏览型号5962-9669105HYX的Datasheet PDF文件第7页 
WMS128K8-XXX  
ABSOLUTE MAXIMUM RATINGS  
TRUTH TABLE  
Parameter  
Symbol  
TA  
Min  
-55  
-65  
-0.5  
Max  
+125  
+150  
VCC+0.5  
150  
Unit  
°C  
°C  
V
CS#  
H
OE#  
X
WE#  
X
Mode  
Standby  
Read  
Data I/O  
High Z  
Power  
Standby  
Active  
Operating Temperature  
Storage Temperature  
Signal Voltage Relative to GND  
Junction Temperature  
Supply Voltage  
TSTG  
VG  
L
L
H
Data Out  
Data In  
High Z  
L
X
L
Write  
Active  
TJ  
°C  
V
L
H
H
Out Disable  
Active  
VCC  
-0.5  
7.0  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Symbol  
VCC  
VIH  
Min  
4.5  
Max  
5.5  
Unit  
V
Supply Voltage  
Input High Voltage  
Input Low Voltage  
Operating Temp. (Mil.)  
2.2  
VCC + 0.3  
+0.8  
V
VIL  
-0.5  
-55  
V
TA  
+125  
°C  
CAPACITANCE  
TA = +25°C  
Parameter  
Symbol  
Condition  
Package  
Speed (ns)  
15 to 55  
15 to 25  
35 to 55  
15 to 55  
15 to 55  
35 to 55  
15 to 55  
Max  
Unit  
32 Pin CSOJ, DIP, Flat Pack Evolutionary  
36 Pin Flat Pack and  
20  
12  
20  
20  
12  
20  
15  
pF  
pF  
pF  
pF  
pF  
pF  
pF  
Input capacitance  
CIN  
VIN = 0V, f = 1.0MHz  
32 Pin CSOJ Revolutionary  
32 Pin CSOJ, DIP, Flat Pack Evolutionary  
36 Pin Flat Pack and  
Output capicitance  
COUT  
VOUT = 0V, f = 1.0MHz  
32 Pin CSOJ Revolutionary  
32 Pin CLCC  
This parameter is guaranteed by design but not tested.  
DC CHARACTERISTICS  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
Parameter  
Symbol  
Conditions  
-15 -17  
-20  
-25  
-35  
-45  
-55  
Units  
Min Max Min Max Min Max Min Max Min Max Min Max Min Max  
Input Leakage Current  
Output Leakage Current  
Operating Supply Current  
Standby Current  
ILI  
ILO  
VCC = 5.5, VIN = GND to VCC  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
μA  
μA  
CS# = VIH, OE# = VIH, VOUT = GND to VCC  
CS# = VIL, OE# = VIH, f = 5MHz, VCC = 5.5  
CS# = VIH, OE# = VIH, f = 5MHz, VCC = 5.5  
IOL = 2.1mA, VCC = 4.5  
ICC  
ISB  
150  
20  
150  
20  
150  
20  
150  
15  
150  
15  
150  
15  
150 mA  
15  
mA  
V
Output Low Voltage  
Output High Voltage  
VOL  
VOH  
0.4  
0.4  
0.4  
0.4  
0.4  
0.4  
0.4  
IOH = -1.0mA, VCC = 4.5  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
V
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V  
Microsemi Corporation reserves the right to change products or specications without notice.  
March 2011 © 2011 Microsemi Corporation. All rights reserved.  
Rev. 6  
2
Microsemi Corporation • (602) 437-1520 • www.microsemi.com  

与5962-9669105HYX相关器件

型号 品牌 描述 获取价格 数据表
5962-9669105HZA ETC x8 SRAM

获取价格

5962-9669105HZC ETC x8 SRAM

获取价格

5962-9669105HZX MICROSEMI Standard SRAM, 128KX8, 55ns, CMOS, CDSO36, CERAMIC, SOJ-36

获取价格

5962-9669106HTA ETC x8 SRAM

获取价格

5962-9669106HTC ETC x8 SRAM

获取价格

5962-9669106HTX MICROSEMI Standard SRAM, 128KX8, 45ns, CMOS, CDSO32, CERAMIC, SOJ-32

获取价格