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5962-9566603Q2A PDF预览

5962-9566603Q2A

更新时间: 2024-01-19 14:09:15
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路
页数 文件大小 规格书
55页 1219K
描述
ADVANCED LINCMOS RAIL-TO-RAIL VERY LOW-POWER OPERATIONAL AMPLIFIERS

5962-9566603Q2A 技术参数

生命周期:Obsolete零件包装代码:QLCC
包装说明:CERAMIC, LCC-20针数:20
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.55
Is Samacsys:N放大器类型:OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB):0.0005 µA标称共模抑制比:77 dB
最大输入失调电压:1000 µVJESD-30 代码:S-CQCC-N20
长度:8.89 mm负供电电压上限:
标称负供电电压 (Vsup):功能数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:QCCN封装形状:SQUARE
封装形式:CHIP CARRIER认证状态:Not Qualified
筛选级别:MIL-PRF-38535 Class Q座面最大高度:2.03 mm
标称压摆率:0.1 V/us子类别:Operational Amplifier
供电电压上限:8 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:NO LEAD
端子节距:1.27 mm端子位置:QUAD
标称均一增益带宽:187 kHz宽度:8.89 mm
Base Number Matches:1

5962-9566603Q2A 数据手册

 浏览型号5962-9566603Q2A的Datasheet PDF文件第1页浏览型号5962-9566603Q2A的Datasheet PDF文件第3页浏览型号5962-9566603Q2A的Datasheet PDF文件第4页浏览型号5962-9566603Q2A的Datasheet PDF文件第5页浏览型号5962-9566603Q2A的Datasheet PDF文件第6页浏览型号5962-9566603Q2A的Datasheet PDF文件第7页 
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  
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SLOS186C − FEBRUARY 1997 − REVISED AUGUST 2006  
TLV2262 AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
SMALL  
OUTLINE  
(D)  
CHIP  
CARRIER  
(FK)  
CERAMIC  
DIP  
PLASTIC  
DIP  
CERAMIC  
FLATPACK  
(U)  
IO  
T
A
TSSOP  
(PW)  
AT 25°C  
(JG)  
(P)  
0°C to 70°C  
2.5 mV  
TLV2262CD  
TLV2262CP TLV2262CPWLE  
950 µV  
2.5 mV  
TLV2262AID  
TLV2262ID  
TLV2262AIP TLV2262AIPWLE  
40°C to 125°C  
TLV2262IP  
950 µV  
2.5 mV  
TLV2262AQD  
TLV2262QD  
40°C to 125°C  
55°C to 125°C  
950 µV  
2.5 mV  
TLV2262AMFK TLV2262AMJG  
TLV2262MFK TLV2262MJG  
TLV2262AMU  
TLV2262MU  
§
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR).  
The PW package is available only left-end taped and reeled.  
Chips are tested at 25°C.  
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site  
at www.ti.com.  
TLV2264 AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
SMALL  
OUTLINE  
(D)  
CHIP  
CARRIER  
(FK)  
CERAMIC  
DIP  
PLASTIC  
DIP  
CERAMIC  
FLATPACK  
(W)  
IO  
T
A
TSSOP  
(PW)  
AT 25°C  
(J)  
(N)  
40°C to  
125°C  
950 µV  
2.5 mV  
TLV2264AID  
TLV2264ID  
TLV2264AIN  
TLV2264IN  
TLV2264AIPWLE  
40°C to  
125°C  
950 µV  
2.5 mV  
TLV2264AQD  
TLV2264QD  
55°C to  
125°C  
950 µV  
2.5 mV  
TLV2264AMFK  
TLV2264MFK  
TLV2264AMJ  
TLV2264MJ  
TLV2264AMW  
TLV2264MW  
§
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262IDR).  
The PW package is available only left-end taped and reeled.  
Chips are tested at 25°C.  
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site  
at www.ti.com.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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