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5962-9461202HBX PDF预览

5962-9461202HBX

更新时间: 2023-05-15 00:00:00
品牌 Logo 应用领域
WEDC 存储闪存
页数 文件大小 规格书
41页 469K
描述
Flash Module, 512KX32, 120ns, CQFP68, CERAMIC, QFP-68

5962-9461202HBX 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:CERAMIC, QFP-68针数:68
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.32.00.51风险等级:5.44
最长访问时间:150 ns其他特性:USER CONFIGURABLE AS 2M X 8
备用内存宽度:16JESD-30 代码:S-CQFP-G68
JESD-609代码:e4长度:22.355 mm
内存密度:16777216 bit内存集成电路类型:FLASH MODULE
内存宽度:32功能数量:1
端子数量:68字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:512KX32封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:QFP封装形状:SQUARE
封装形式:FLATPACK并行/串行:PARALLEL
编程电压:5 V认证状态:Not Qualified
筛选级别:MIL-STD-883座面最大高度:3.56 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子面层:GOLD端子形式:GULL WING
端子节距:1.27 mm端子位置:QUAD
宽度:22.355 mmBase Number Matches:1

5962-9461202HBX 数据手册

 浏览型号5962-9461202HBX的Datasheet PDF文件第33页浏览型号5962-9461202HBX的Datasheet PDF文件第34页浏览型号5962-9461202HBX的Datasheet PDF文件第35页浏览型号5962-9461202HBX的Datasheet PDF文件第37页浏览型号5962-9461202HBX的Datasheet PDF文件第38页浏览型号5962-9461202HBX的Datasheet PDF文件第39页 
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:  
a.End-point electrical parameters shall be as specified in table II herein.  
b.Steady-state life test, method 1005 of MIL-STD-883.  
(1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and  
shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test  
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent  
specified in method 1005 of MIL-STD-883.  
(2) T as specified in accordance with table I of method 1005 of MIL-STD-883.  
A
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.  
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.  
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.  
5. PACKAGING  
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.  
6. NOTES  
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications  
(original equipment), design applications, and logistics purposes.  
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-  
prepared specification or drawing.  
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF-  
38534.  
6.4 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires  
configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used  
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)  
should contact DLA Land and Maritime-VA, telephone (614) 692-8108.  
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,  
or telephone (614) 692-1081.  
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103  
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to  
this drawing.  
SIZE  
STANDARD  
5962-94612  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
SHEET  
DLA LAND AND MARITIME  
COLUMBUS, OHIO 43218-3990  
J
36  
DSCC FORM 2234  
APR 97  

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