Hermetically Sealed,High Speed,High CMR,
Logic Gate Optocouplers
DataSheet
6N134,* 81028, HCPL-563X, HCPL-663X, HCPL-565X, 5962-98001,
HCPL-268K, HCPL-665X, 5962-90855, HCPL-560X
*See matrix for available extensions.
Features
Description
• Dual marked with device part number and DSCC
drawing number
• Manufactured and tested on a MIL-PRF-38534
Certified Line
These units are single, dual and quad channel,
hermetically sealed optocouplers. The products are
capable of operation and storage over the full military
temperature range and can be purchased as either
standard product or with full MIL-PRF-38534 Class Level
H or K testing or from the appropriate DSCC Drawing. All
devicesare manufactured and tested on aMIL-PRF-38534
certified line and are included in the DSCC Qualified
Manufacturers List QML-38534 for Hybrid Microcircuits.
Quad channel devices are available by special order in
the 16 pin DIP through hole packages.
• QML-38534, Class H and K
• Five hermetically sealed package configurations
• Performance guaranteed over full military
temperature range: -55°C to +125°C
• High speed: 10 M Bit/s
• CMR: > 10,000 V/µs typical
• 1500 Vdc withstand test voltage
• 2500 Vdc withstand test voltage for HCPL-565X
• High radiation immunity
• 6N137, HCPL-2601, HCPL-2630/-31 function
compatibility
• Reliability data
Truth Table (Positive Logic)
Multichannel Devices
Input
Output
• TTL circuit compatibility
On (H)
Off (L)
L
H
Applications
• Military and space
• High reliability systems
• Transportation, medical, and life critical systems
• Line receiver
• Voltage level shifting
Single Channel DIP
Input
Enable
Output
On (H)
Off (L)
On (H)
Off (L)
H
H
L
L
L
• Isolated input line receiver
• Isolated output line driver
• Logic ground isolation
• Harsh industrial environments
• Isolation for computer, communication, and test
equipment systems
H
H
H
Functional Diagram
Multiple channel devices available
V
CC
V
E
V
OUT
GND
The connection of a 0.1 µF bypass capacitor between VCC and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage
and/or degradation which may be induced by ESD.