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5962-9080802Q2AX PDF预览

5962-9080802Q2AX

更新时间: 2024-01-14 07:22:17
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
75页 1340K
描述
DUAL OP-AMP, 6000uV OFFSET-MAX, 1.3MHz BAND WIDTH, CQCC20

5962-9080802Q2AX 技术参数

生命周期:Obsolete包装说明:QCCN,
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.84
放大器类型:OPERATIONAL AMPLIFIER最大平均偏置电流 (IIB):0.03 µA
标称共模抑制比:82 dB最大输入失调电压:6000 µV
JESD-30 代码:S-CQCC-N20长度:8.89 mm
负供电电压上限:-19 V标称负供电电压 (Vsup):-5 V
功能数量:2端子数量:20
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QCCN
封装形状:SQUARE封装形式:CHIP CARRIER
认证状态:Not Qualified座面最大高度:2.03 mm
标称压摆率:3.4 V/us子类别:Operational Amplifier
供电电压上限:19 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:BIFET
温度等级:MILITARY端子形式:NO LEAD
端子节距:1.27 mm端子位置:QUAD
标称均一增益带宽:1300 kHz宽度:8.89 mm

5962-9080802Q2AX 数据手册

 浏览型号5962-9080802Q2AX的Datasheet PDF文件第3页浏览型号5962-9080802Q2AX的Datasheet PDF文件第4页浏览型号5962-9080802Q2AX的Datasheet PDF文件第5页浏览型号5962-9080802Q2AX的Datasheet PDF文件第7页浏览型号5962-9080802Q2AX的Datasheet PDF文件第8页浏览型号5962-9080802Q2AX的Datasheet PDF文件第9页 
TLE206x, TLE206xA, TLE206xB, TLE206xY  
EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE  
µPOWER OPERATIONAL AMPLIFIERS  
SLOS193A – FEBRUARY 1997 – REVISED MARCH 1998  
TLE2064Y chip information  
This chip, when properly assembled, displays characteristics similar to the TLE2064. Thermal compression or  
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive  
epoxy or a gold-silicon preform.  
BONDING PAD ASSIGNMENTS  
V
CC+  
(4)  
(3)  
(2)  
+
1IN+  
1IN–  
(1)  
1OUT  
(5)  
(6)  
+
2IN+  
2IN–  
(11)  
(10)  
(9)  
(13)  
(12)  
(7)  
2OUT  
(8)  
(14)  
(10)  
(9)  
+
3IN+  
3IN–  
(8)  
3OUT  
(12)  
(13)  
+
4IN+  
4IN–  
(14)  
4OUT  
73  
(11)  
V
CC–  
(7)  
(1)  
(2)  
(3)  
(5)  
(6)  
(4)  
CHIP THICKNESS: 15 MILS TYPICAL  
BONDING PADS: 4 × 4 MILS MINIMUM  
139  
T max = 150°C  
J
TOLERANCES ARE ±10%.  
ALL DIMENSIONS ARE IN MILS.  
PIN (11) IS INTERNALLY CONNECTED  
TO BACKSIDE OF CHIP.  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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