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5962-9080703QPA PDF预览

5962-9080703QPA

更新时间: 2024-02-18 09:31:05
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路输出元件输入元件驱动
页数 文件大小 规格书
75页 1499K
描述
EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE mPOWER OPERATIONAL AMPLIFIERS

5962-9080703QPA 技术参数

生命周期:Active零件包装代码:DIP
包装说明:DIP-8针数:8
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.41
Is Samacsys:N放大器类型:OPERATIONAL AMPLIFIER
架构:VOLTAGE-FEEDBACK最大平均偏置电流 (IIB):0.03 µA
25C 时的最大偏置电流 (IIB):0.04 µA最小共模抑制比:72 dB
标称共模抑制比:82 dB频率补偿:YES
最大输入失调电流 (IIO):0.02 µA最大输入失调电压:3100 µV
JESD-30 代码:R-GDIP-T8长度:9.58 mm
低-偏置:YES低-失调:NO
微功率:YES负供电电压上限:-19 V
标称负供电电压 (Vsup):-5 V功能数量:1
端子数量:8最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装等效代码:DIP8,.3
封装形状:RECTANGULAR封装形式:IN-LINE
包装方法:TUBE峰值回流温度(摄氏度):NOT SPECIFIED
功率:NO电源:+-5/+-15 V
可编程功率:NO认证状态:Qualified
筛选级别:MIL-PRF-38535 Class Q座面最大高度:5.08 mm
最小摆率:1.8 V/us标称压摆率:3.4 V/us
子类别:Operational Amplifier最大压摆率:0.375 mA
供电电压上限:19 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:BIFET
温度等级:MILITARY端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED标称均一增益带宽:1300 kHz
最小电压增益:500宽带:NO
宽度:7.62 mmBase Number Matches:1

5962-9080703QPA 数据手册

 浏览型号5962-9080703QPA的Datasheet PDF文件第1页浏览型号5962-9080703QPA的Datasheet PDF文件第3页浏览型号5962-9080703QPA的Datasheet PDF文件第4页浏览型号5962-9080703QPA的Datasheet PDF文件第5页浏览型号5962-9080703QPA的Datasheet PDF文件第6页浏览型号5962-9080703QPA的Datasheet PDF文件第7页 
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µ
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SLOS193B − FEBRUARY 1997 − REVISED MAY 2004  
TLE2061 AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP  
CARRIER  
(FK)  
CERAMIC  
DIP  
PLASTIC  
DIP  
CERAMIC  
FLAT PACK  
(U)  
SMALL  
OUTLINE  
(D)  
V
max  
TSSOP  
(PW)  
IO  
T
A
AT 25°C  
(JG)  
(P)  
500 µV  
1.5 mV TLE2061ACD  
3 mV TLE2061CD  
TLE2061ACP  
0°C to 70°C  
40°C to 85°C  
55°C to 125°C  
TLE2061CP  
TLE2061CPWLE  
500 µV  
1.5 mV TLE2061AID  
3 mV TLE2061ID  
TLE2061AIP  
TLE2061IP  
500 µV  
TLE2061BMJG  
1.5 mV TLE2061AMD TLE2061AMFK TLE2061AMJG  
3 mV TLE2061MD TLE2061MFK TLE2061MJG  
TLE2061AMU  
TLE2061MU  
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2061ACDR).Chips are tested at 25°C.  
The PW package is available left-end taped and reeled (indicated by the LE suffix on the device type (e.g., TLE2061CPWLE).  
TLE2062 AVAILABLE OPTIONS  
PACKAGED DEVICES  
CERAMIC  
V
max  
CHIP CARRIER  
(FK)  
CERAMIC DIP  
(JG)  
PLASTIC DIP  
(P)  
SMALL OUTLINE  
(D)  
IO  
T
A
FLAT PACK  
(U)  
AT 25°C  
0°C  
to  
70°C  
1 mV  
2 mV  
4 mV  
TLE2062BCD  
TLE2062ACD  
TLE2062CD  
TLE2062BCP  
TLE2062ACP  
TLE2062CP  
40°C  
to  
85°C  
1 mV  
2 mV  
4 mV  
TLE2062BID  
TLE2062AID  
TLE2062ID  
TLE2062BIP  
TLE2062AIP  
TLE2062IP  
55°C  
to  
125°C  
1 mV  
2 mV  
4 mV  
TLE2062BMD  
TLE2062AMD  
TLE2062MD  
TLE2062BMJG  
TLE2062AMJG  
TLE2062MJG  
TLE2062AMFK  
TLE2062MFK  
TLE2062AMU  
TLE2062MU  
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2062ACDR).  
TLE2064 AVAILABLE OPTIONS  
PACKAGED DEVICES  
CERAMIC  
FLAT PACK  
(W)  
V
max  
CHIP CARRIER  
(FK)  
CERAMIC DIP  
(J)  
PLASTIC DIP  
(N)  
SMALL OUTLINE  
(D)  
IO  
T
A
AT 25°C  
0°C  
to  
70°C  
2 mV  
4 mV  
6 mV  
TLE2064BCN  
TLE2064ACN  
TLE2064CN  
TLE2064ACD  
TLE2064CD  
40°C  
to  
85°C  
2 mV  
4 mV  
6 mV  
TLE2064BIN  
TLE2064AIN  
TLE2064IN  
TLE2064AID  
TLE2064ID  
55°C  
to  
125°C  
2 mV  
4 mV  
6 mV  
TLE2064BMFK  
TLE2064AMFK  
TLE2064MFK  
TLE2064BMJ  
TLE2064AMJ  
TLE2064MJ  
TLE2064AMD  
TLE2064MD  
TLE2064AMW  
TLE2064MW  
The D packages are available taped and reeled. Add R suffix to device type, (e.g., TLE2064ACDR).  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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