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5962-89611012A PDF预览

5962-89611012A

更新时间: 2024-01-08 02:07:09
品牌 Logo 应用领域
德州仪器 - TI 驱动器MOSFET驱动器驱动程序和接口接口集成电路
页数 文件大小 规格书
8页 212K
描述
Dual Output Driver

5962-89611012A 技术参数

生命周期:Obsolete包装说明:CERAMIC, QCC-20
Reach Compliance Code:unknown风险等级:5.11
Is Samacsys:N高边驱动器:NO
接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVERJESD-30 代码:S-CQCC-N20
功能数量:2端子数量:20
最高工作温度:125 °C最低工作温度:-55 °C
标称输出峰值电流:1.5 A封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:QCCN封装等效代码:LCC20,.35SQ
封装形状:SQUARE封装形式:CHIP CARRIER
认证状态:Not Qualified筛选级别:38535Q/M;38534H;883B
子类别:MOSFET Drivers最大供电电压:40 V
最小供电电压:5 V标称供电电压:20 V
表面贴装:YES技术:BIPOLAR
温度等级:MILITARY端子形式:NO LEAD
端子节距:1.27 mm端子位置:QUAD
断开时间:0.13 µs接通时间:0.14 µs
Base Number Matches:1

5962-89611012A 数据手册

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PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF UC1706, UC2706, UC2706M, UC3706, UC3706M :  
Catalog: UC3706, UC2706, UC3706M, UC3706  
Military: UC2706M, UC1706, UC1706  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 2  

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