Absolute Maximum Ratings (Note 1)
Reverse Current
30 mA
10 mA
Forward Current
Operating Temperature Range
Storage Temperature
Maximum Junction Temperature (TJmax) (Note 2)
Lead Temperature (Soldering, 10 sec)
TO-46 Metal Can
−55˚C ≤ TA ≤ + 125˚C
−55˚C ≤ TA ≤ + 150˚C
150˚C
300˚C
260˚C
Ceramic SOIC
Thermal Resistance
θJA
T0–46 Metal Can (Still Air)
T0–46 Metal Can (500LF / Min Air Flow)
Ceramic SOIC (Still Air)
Ceramic SOIC (500LF / Min Air Flow)
θJC
300˚C/W
139˚C/W
194˚C/W
128˚C/W
T0–46 Metal Can
57˚C/W
23˚C/W
Ceramic SOIC
Package Weight (Typical)
T0–46 Metal Can
TBD
Ceramic SOIC
210 mg
4000V
ESD Tolerance (Note 3)
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Static tests at
Static tests at
Static tests at
Temp ˚C
25
1
2
3
125
-55
25
4
5
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
Settling time at
125
-55
25
6
7
8A
8B
9
125
-55
25
10
11
12
13
14
125
-55
25
Settling time at
125
-55
Settling time at
3
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