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5962-8404501VDX PDF预览

5962-8404501VDX

更新时间： 2024-02-14 01:52:13
品牌 Logo 应用领域
德州仪器 - TI 栅极逻辑集成电路输入元件
页数 文件大小 规格书
21页 1141K
描述
HC/UH SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, DFP-14

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5962-8404501VDX 技术参数

生命周期：Active零件包装代码：DFP
包装说明：DFP,针数：14
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.27Is Samacsys：N
系列：HC/UHJESD-30 代码：R-GDFP-F14
长度：9.21 mm逻辑集成电路类型：OR GATE
功能数量：4输入次数：2
端子数量：14最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：CERAMIC, GLASS-SEALED
封装代码：DFP封装形状：RECTANGULAR
封装形式：FLATPACK峰值回流温度（摄氏度）：NOT APPLICABLE
传播延迟（tpd）：150 ns认证状态：Qualified
座面最大高度：2.03 mm最大供电电压 (Vsup)：6 V
最小供电电压 (Vsup)：2 V标称供电电压 (Vsup)：5 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子形式：FLAT
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT APPLICABLE宽度：6.285 mm
Base Number Matches：1

5962-8404501VDX 数据手册

 浏览型号5962-8404501VDX的Datasheet PDF文件第4页浏览型号5962-8404501VDX的Datasheet PDF文件第5页浏览型号5962-8404501VDX的Datasheet PDF文件第6页浏览型号5962-8404501VDX的Datasheet PDF文件第8页浏览型号5962-8404501VDX的Datasheet PDF文件第9页浏览型号5962-8404501VDX的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Oct-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
SN74HC32PWR  
SN74HC32PWRE4  
SN74HC32PWRG4  
SN74HC32PWT  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
LCCC  
PW  
14  
14  
14  
14  
14  
14  
20  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
POST-PLATE  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
HC32  
HC32  
HC32  
HC32  
HC32  
HC32  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PW  
PW  
PW  
PW  
PW  
FK  
2000  
2000  
250  
250  
250  
1
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
SN74HC32PWTE4  
SN74HC32PWTG4  
SNJ54HC32FK  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TBD  
84045012A  
SNJ54HC  
32FK  
SNJ54HC32J  
SNJ54HC32W  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
8404501CA  
SNJ54HC32J  
W
8404501DA  
SNJ54HC32W  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 3  
1...45678910...21

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