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5962-3826707MZV PDF预览

5962-3826707MZV

更新时间: 2024-01-27 04:47:51
品牌 Logo 应用领域
麦斯威 - MAXWELL 存储可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
40页 315K
描述
MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K x 8 BIT EEPROM, MONOLITHIC SILICON

5962-3826707MZV 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Transferred零件包装代码:DFP
包装说明:DFP,针数:32
Reach Compliance Code:compliantECCN代码:3A001.A.2.C
HTS代码:8542.32.00.51风险等级:5.04
Is Samacsys:N最长访问时间:120 ns
其他特性:AUTOMATIC WRITE; DATA RETENTION: 10 YEARS数据保留时间-最小值:10
JESD-30 代码:R-CDFP-F32JESD-609代码:e0
长度:20.85 mm内存密度:1048576 bit
内存集成电路类型:EEPROM内存宽度:8
功能数量:1端子数量:32
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:128KX8
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:DFP
封装形状:RECTANGULAR封装形式:FLATPACK
并行/串行:PARALLEL峰值回流温度(摄氏度):240
编程电压:5 V认证状态:Not Qualified
筛选级别:MIL-STD-883座面最大高度:3.05 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:12.2 mm
最长写入周期时间 (tWC):10 msBase Number Matches:1

5962-3826707MZV 数据手册

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2. APPLICABLE DOCUMENTS  
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part  
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the  
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the  
solicitation.  
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.  
STANDARDS  
DEPARTMENT OF DEFENSE  
MIL-STD-883  
-
Test Method Standard Microcircuits.  
MIL-STD-1835 - Interface Standard for Microcircuit Case Outlines.  
HANDBOOKS  
DEPARTMENT OF DEFENSE  
MIL-HDBK-103 - List of Standard Microcircuit Drawings.  
MIL-HDBK-780 - Standard Microcircuit Drawings.  
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).  
2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless  
otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cited in the  
solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited  
in the solicitation.  
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)  
ASTM Standard F1192-88  
-
Standard Guide for the Measurement of Single Event Phenomena from  
Heavy Ion Irradiation of Semiconductor Devices.  
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials, 1916  
Race Street, Philadelphia, PA 19103).  
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)  
JEDEC Standard EIA/JESD78 - I/C Latch-up Test.  
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington,  
VA 22201).  
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute  
the documents. These documents also may be available in or through libraries or other informational services).  
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of  
this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a  
specific exemption has been obtained.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-38267  
A
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
G
SHEET  
4
DSCC FORM 2234  
APR 97  

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