ADS5400-SP
SLAS669C –SEPTEMBER 2010–REVISED AUGUST 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. PACKAGE/ORDERING INFORMATION(1)
TEMPERATURE
PACKAGE(2)
ORDERABLE PART NUMBER
ADS5400MHFSV
TOP-SIDE MARKING
5962-0924001VXC
ADS5400MHFS-V
–55°C to 125°C Tcase
5962-0924001VXC
CFP-HFS
ADS5400HFS/EM(3)
EVAL ONLY
25°C
ADS5400HFSMPR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, standard packaging quanities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(3) These units are intended for engineering evaluation only. They are processed to a non-compliant flow (e.g. No Burn-In, etc.) and are
tested to a temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts
are not warranted for performance over the full MIL specified temperature range of -55°C to 125°C or operating life.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
UNIT
V
AVDD5 to GND
6
5
Supply voltage
AVDD3 to GND
V
DVDD3 to GND
AINP, AINN to GND(2)
5
V
voltage difference between pin and ground
0.5 to 4.5
–0.3 to (AVDD5 + 0.3)
1.25 to 3.75
1.75 to 3.25
0.5 to 4.5
1.1 to 3.9
V
short duration
V
voltage difference between
(2)
AINP to AINN
pins, common mode at
AVDD5/2
continuous AC signal
continuous DC signal
V
V
(2)
CLKINP, CLKINN to GND
voltage difference between pin and ground
V
voltage difference between
pins, common mode at
AVDD5/2
continuous AC signal
continuous DC signal
V
(2)
CLKINP to CLKINN
2 to 3
V
(2)
RESETP, RESETN to GND
voltage difference between pin and ground
–0.3 to (AVDD5 + 0.3)
1.1 to 3.9
V
V
V
continuous AC signal
continuous DC signal
voltage difference between
pins
(2)
RESETP to RESETN
2 to 3
(2)
Data/OVR Outputs to GND
–0.3 to (DVDD3 + 0.3)
–0.3 to (AVDD3 + 0.3)
SDENB, SDIO, SCLK to GND(2)
voltage difference between pin and ground
V
ENA1BUS, ENPWD, ENEXTREF
to GND(2)
–0.3 to (AVDD5 + 0.3)
Operating case temperature range
Maximum junction temperature, TJ
Storage temperature range
–55 to 125
150
°C
°C
°C
kV
–65 to 150
2
ESD, human-body model (HBM)
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime is available upon
request.
(2) Valid when supplies are within recommended operating range.
2
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