MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
A.4.5.4.1 Group C sample selection............................................................................................................................81
A.4.5.4.1.1 Microcircuit group assignments ................................................................................................................81
A.4.5.4.1.2 Product acceptable for delivery.................................................................................................................81
A.4.5.5 Group D inspection.........................................................................................................................................81
A.4.5.5.1 Group D sample selection............................................................................................................................84
A.4.5.5.2 Incoming vendor material control program...................................................................................................84
A.4.5.6 Group E inspection .........................................................................................................................................84
A.4.5.6.1 Group E sample selection............................................................................................................................84
A.4.5.7 End-point tests for groups B, C, and D (and E if applicable) inspections........................................................84
A.4.5.8 Nonconformance ............................................................................................................................................85
A.4.5.8.1 Group B failure.............................................................................................................................................85
A.4.5.8.2 Alternate group B failure..............................................................................................................................85
A.4.5.8.3 Group C failure ............................................................................................................................................86
A.4.5.8.4 Group D failure ............................................................................................................................................86
A.4.6 Screening...........................................................................................................................................................86
A.4.6.1 Burn-in............................................................................................................................................................86
A.4.6.1.1 Lots and sublots resubmitted for burn-in......................................................................................................86
A.4.6.1.2 Burn-in acceptance criteria ..........................................................................................................................87
A.4.6.1.2.1 Failure analysis of burn-in screen failures for class level S devices .........................................................87
A.4.6.2 External visual screen.....................................................................................................................................87
A.4.6.3 Particle impact noise detection (PIND) test for class level S devices .............................................................87
A.4.6.4 Lead forming...................................................................................................................................................87
A.4.6.5 Nondestructive bond pull test for class level S devices...................................................................................87
A.4.7 Test results ........................................................................................................................................................88
A.4.7.1 Screening test data for class level S microcircuits..........................................................................................88
A.4.8 Quality assurance program................................................................................................................................88
A.4.8.1 Manufacturer certification................................................................................................................................88
A.4.8.1.1 Design, processing, manufacturing, and testing instructions.......................................................................89
A.4.8.1.1.1 Conversion of customer requirements into manufacturer's internal instructions.......................................89
A.4.8.1.1.2 Personnel training and testing ..................................................................................................................89
A.4.8.1.1.3 Inspection of incoming materials and utilities, and of work in-process......................................................89
A.4.8.1.1.4 Quality control operations .........................................................................................................................89
A.4.8.1.1.5 Quality assurance operations ...................................................................................................................89
A.4.8.1.1.6 Design, processing, manufacturing equipment, and materials instructions...............................................91
A.4.8.1.1.7 Cleanliness and atmosphere control in work areas ..................................................................................91
A.4.8.1.1.8 Design, material, and process change control..........................................................................................91
A.4.8.1.1.9 Tool, gauge, and test equipment maintenance and calibration.................................................................91
A.4.8.1.1.10 Failure and defect analysis and feedback...............................................................................................92
A.4.8.1.1.11 Corrective action and evaluation.............................................................................................................92
A.4.8.1.1.12 Incoming, in-process, and outgoing inventory control.............................................................................92
A.4.8.1.1.13 Schematics .............................................................................................................................................92
A.4.8.1.1.14 ESD handling control program................................................................................................................92
A.4.8.1.2 Records to be maintained............................................................................................................................92
A.4.8.1.2.1 Personnel training and testing ..................................................................................................................94
A.4.8.1.2.1.1 Training of operators and inspectors......................................................................................................94
A.4.8.1.2.2 Inspection operations................................................................................................................................94
A.4.8.1.2.3 Failure and defect reports and analyses...................................................................................................94
A.4.8.1.2.4 Initial documentation and subsequent changes in design, materials, or processing.................................94
A.4.8.1.2.5 Equipment calibrations..............................................................................................................................95
A.4.8.1.2.6 Process, utility, and material controls........................................................................................................95
A.4.8.1.2.7 Product lot identification............................................................................................................................95
A.4.8.1.2.8 Product traceability ...................................................................................................................................95
A.4.8.1.3 Quality assurance program plan..................................................................................................................95
A.4.8.1.3.1 Functional block organization chart ..........................................................................................................96
A.4.8.1.3.2 Examples of manufacturing flowchart.......................................................................................................96
viii
5秒后页面跳转
SG3525资料手册详解：SG3525参数分析、引脚说明、应用介绍
AT89C51单片机资料手册详细解析及应用示例
CP2102资料手册解读：CP2102引脚说明、关键参数分析
资料手册解读：UC3842参数和管脚说明
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
