MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
3.6.3.2 JAN or J mark .................................................................................................................................................14
3.6.4 Manufacturer's identification...............................................................................................................................14
3.6.4.1 Code for assembly sites..................................................................................................................................14
3.6.5 Country of origin.................................................................................................................................................14
3.6.6 Date code...........................................................................................................................................................14
3.6.7 Marking location and sequence..........................................................................................................................14
3.6.7.1 Beryllium oxide package identifier...................................................................................................................14
3.6.7.2 Electrostatic discharge (ESD) sensitivity identifier ..........................................................................................14
3.6.8 QML marked product .........................................................................................................................................15
3.6.9 Marking on container..........................................................................................................................................15
3.7 Remarking.............................................................................................................................................................15
3.8 Screening and test ................................................................................................................................................15
3.9 Technology conformance inspection (TCI)............................................................................................................15
3.9.1 TCI assessment .................................................................................................................................................15
3.10 Solderability.........................................................................................................................................................15
3.11 Traceability..........................................................................................................................................................15
3.12 ESD control.........................................................................................................................................................15
3.13 Recycled, recovered, or environmentally preferable materials............................................................................15
3.14 Alternate test requirements.................................................................................................................................16
3.15 Passive elements................................................................................................................................................16
3.15.1 Capacitors........................................................................................................................................................16
4. VERIFICATION.......................................................................................................................................................17
4.1 Verification ............................................................................................................................................................17
4.2 Screening..............................................................................................................................................................17
4.2.1 Screen testing failures........................................................................................................................................17
4.2.2 Screening resubmission criteria .........................................................................................................................17
4.2.3 Electrostatic discharge (ESD) sensitivity............................................................................................................17
4.3 Technology conformance inspection (TCI)............................................................................................................17
4.4 Qualification inspection .........................................................................................................................................17
5. PACKAGING...........................................................................................................................................................34
5.1 Packaging .............................................................................................................................................................34
6. NOTES....................................................................................................................................................................34
6.1 Intended use .........................................................................................................................................................34
6.1.1 Class T...............................................................................................................................................................34
6.2 Acquisition requirements.......................................................................................................................................34
6.3 Qualification ..........................................................................................................................................................34
6.4 Terms and definitions............................................................................................................................................34
6.4.1 Microelectronics .................................................................................................................................................34
6.4.2 Element (of a microcircuit or integrated circuit) ..................................................................................................34
6.4.3 Substrate (of a microcircuit or integrated circuit)................................................................................................35
6.4.4 Integrated circuit (microcircuit) ...........................................................................................................................35
6.4.4.1 Multichip microcircuit.......................................................................................................................................35
6.4.4.2 Monolithic microcircuit.....................................................................................................................................35
6.4.4.3 Microcircuit module .........................................................................................................................................35
6.4.5 Production lot .....................................................................................................................................................35
6.4.6 Inspection lot......................................................................................................................................................35
6.4.7 Wafer lot.............................................................................................................................................................35
6.4.8 Percent defective allowable (PDA).....................................................................................................................35
6.4.9 Delta limit ...........................................................................................................................................................35
6.4.10 Rework.............................................................................................................................................................35
6.4.11 Final seal..........................................................................................................................................................35
6.4.12 Acquiring activity ..............................................................................................................................................36
6.4.13 Qualifying activity (QA).....................................................................................................................................36
6.4.14 Parts per million (PPM) ....................................................................................................................................36
6.4.15 Device type ......................................................................................................................................................36
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