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5962-0050601Q2A PDF预览

5962-0050601Q2A

更新时间： 2024-02-04 21:00:45
品牌 Logo 应用领域
德州仪器 - TI 解复用器
页数 文件大小 规格书
22页 796K
描述
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS

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5962-0050601Q2A 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Obsolete零件包装代码：QLCC
包装说明：QCCN, LCC20,.35SQ针数：20
Reach Compliance Code：not_compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.75
系列：LVC/LCX/ZJESD-30 代码：S-CQCC-N20
长度：8.89 mm负载电容（CL）：50 pF
逻辑集成电路类型：MULTIPLEXER最大I（ol）：0.024 A
功能数量：4输入次数：2
输出次数：1端子数量：20
最高工作温度：125 °C最低工作温度：-55 °C
输出极性：TRUE封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装代码：QCCN封装等效代码：LCC20,.35SQ
封装形状：SQUARE封装形式：CHIP CARRIER
峰值回流温度（摄氏度）：NOT SPECIFIED电源：3.3 V
Prop。Delay @ Nom-Sup：5.4 ns传播延迟（tpd）：6.2 ns
认证状态：Not Qualified筛选级别：MIL-PRF-38535 Class Q
座面最大高度：2.03 mm子类别：Multiplexer/Demultiplexer
最大供电电压 (Vsup)：3.6 V最小供电电压 (Vsup)：2 V
标称供电电压 (Vsup)：2.7 V表面贴装：YES
技术：CMOS温度等级：MILITARY
端子形式：NO LEAD端子节距：1.27 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：8.89 mmBase Number Matches：1

5962-0050601Q2A 数据手册

 浏览型号5962-0050601Q2A的Datasheet PDF文件第6页浏览型号5962-0050601Q2A的Datasheet PDF文件第7页浏览型号5962-0050601Q2A的Datasheet PDF文件第8页浏览型号5962-0050601Q2A的Datasheet PDF文件第10页浏览型号5962-0050601Q2A的Datasheet PDF文件第11页浏览型号5962-0050601Q2A的Datasheet PDF文件第12页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Apr-2010  
Orderable Device  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SN74LVC157APWTE4  
SN74LVC157APWTG4  
SN74LVC157ARGYR  
SN74LVC157ARGYRG4  
TSSOP  
PW  
16  
16  
16  
16  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
VQFN  
VQFN  
PW  
RGY  
RGY  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SNJ54LVC157AFK  
SNJ54LVC157AJ  
SNJ54LVC157AW  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
CFP  
FK  
J
20  
16  
16  
1
1
1
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
W
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54LVC157A, SN74LVC157A :  
Automotive: SN74LVC157A-Q1  
Enhanced Product: SN74LVC157A-EP  
•
•
NOTE: Qualified Version Definitions:  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Enhanced Product - Supports Defense, Aerospace and Medical Applications  
•
•
Addendum-Page 2  
1...6789101112...22

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