Datasheet > 56F801_1

56F801_1

更新时间： 2022-12-14 23:33:40

品牌	Logo	应用领域
飞思卡尔 - FREESCALE		控制器
页数	文件大小	规格书
48页	536K
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16-bit Digital Signal Controllers

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56F801_1 数据手册

Thermal Design Considerations

Part 5 Design Considerations

5.1 Thermal Design Considerations

An estimation of the chip junction temperature, T , in °C can be obtained from the equation:

Equation 1:T_J= T_A+ (P_D× R_θJA

)

Where:

T_A= ambient temperature °C

R_θJA= package junction-to-ambient thermal resistance °C/W

P_D= power dissipation in package

Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and

a case-to-ambient thermal resistance:

Equation 2:R_θJA= R_θJC+ R_θCA

Where:

R_θJA= package junction-to-ambient thermal resistance °C/W

R_θJC= package junction-to-case thermal resistance °C/W

R_θCA= package case-to-ambient thermal resistance °C/W

is device-related and cannot be influenced by the user. The user controls the thermal environment to

θJC

change the case-to-ambient thermal resistance, R

. For example, the user can change the air flow around

θCA

the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or

otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This

model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through

the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where

the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the

device thermal performance may need the additional modeling capability of a system level thermal

simulation tool.

The thermal performance of plastic packages is more dependent on the temperature of the PCB to which

the package is mounted. Again, if the estimations obtained from R

the thermal performance is adequate, a system level model may be appropriate.

do not satisfactorily answer whether

θJA

Definitions:

A complicating factor is the existence of three common definitions for determining the junction-to-case

thermal resistance in plastic packages:

•

Measure the thermal resistance from the junction to the outside surface of the package (case) closest to the

chip mounting area when that surface has a proper heat sink. This is done to minimize temperature variation

across the surface.

56F801 Technical Data, Rev. 17

Freescale Semiconductor

1...40 41 424344 45 46...48

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