Datasheet > 54F273FMB

54F273FMB

更新时间： 2024-02-08 11:34:35

品牌	Logo	应用领域
德州仪器 - TI		逻辑集成电路
页数	文件大小	规格书
8页	167K
描述
D FLIP-FLOP

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技术参数
数据手册

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54F273FMB 技术参数

生命周期：	Obsolete	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.66
逻辑集成电路类型：	D FLIP-FLOP	Base Number Matches：	1

54F273FMB 数据手册

AC Electrical Characteristics

74F

54F

74F

e a

25 C

5.0V

50 pF

, V

Mil

, V

A CC

Com

e a

Symbol

Parameter

Units

50 pF

Min

Typ

Max

Min

Max

Min

Max

Maximum Clock Frequency

160

130

MHz

max

Propagation Delay

Clock to Output

3.0

4.0

7.0

2.5

3.0

9.5

2.5

3.5

7.5

9.0

PLH

9.00

11.0

PHL

Propagation Delay

MR to Output

PLH

4.5

9.5

3.0

11.0

4.0

10.0

PHL

AC Operating Requirements

74F

54F

74F

e a

25 C

5.0V

Symbol

Parameter

, V

Mil

Max

, V

A CC

Com

Max

Units

Min

Max

Min

t (H)

Setup Time, HIGH or LOW

Data to CP

3.0

3.5

4.0

3.0

3.5

t (L)

t (H)

Hold Time, HIGH or LOW

Data to CP

0.5

1.0

0.5

1.0

t (L)

(L)

MR Pulse Width, LOW

6.0

4.0

6.0

(H)

(L)

CP Pulse Width

HIGH or LOW

6.0

5.0

6.0

Recovery Time, MR to CP

3.0

4.5

3.5

rec

Ordering Information

The device number is used to form part of a simplified purchasing code where a package type and temperature range are

defined as follows:

74F 273

Temperature Range Family

54F Military

Special Variations

74F Commercial

Devices shipped in 13 reels

Military grade with environmental

and burn-in processing shipped

in tubes

Device Type

Package Code

Temperature Range

Plastic DIP

Ceramic DIP

Small Outline SOIC JEDEC

Small Outline SOIC EIAJ

Flatpak

Commercial (0 C to 70 C)

b a

Military ( 55 C to 125 C)

Leadless Chip Carrier (LCC)

1 2 345 6 7 8

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