chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options, see Selection Guide
Table for details. Standard
Military Drawing (SMD) parts are
available for each package and
lead style.
capability will enable the designer
to interface any TTL family to
CMOS. The availability of the
base lead allows optimized gain/
bandwidth adjustment in analog
applications. The shallow depth
of the IC photodiode provides
better radiation immunity than
conventional phototransistor
couplers.
similarities give justification for
the use of data obtained from one
part to represent other part’s
performance for die related
reliability and certain limited
radiation test results.
Because the same functional die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and
limitations and are as noted.
Additionally, the same package
assembly processes and materials
are used in all devices. These
8 Pin Ceramic DIP Single
Channel Schematic
These products are also available
with the transistor base node
connected to improve common
mode noise immunity and ESD
susceptibility. In addition, higher
CTR minimums are available by
special request.
I
I
I
CC
8
7
6
I
F
2
+
V
V
V
CC
ANODE
B
B
V
F
O
–
3
O
CATHODE
5
GND
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
Note base pin 7.
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
16 Pin DIP
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack 20 Pad LCCC
Through Hole Through Hole Through Hole Unformed Leads
Surface Mount
Channels
2
1
2
4
2
Common Channel Wiring
HP Part # & Options
Commercial
None
None
V
CC GND
V
CC GND
None
4N55*
HCPL-5500
HCPL-5501
HCPL-550K
Gold Plate
HCPL-5530
HCPL-5531
HCPL-553K
Gold Plate
HCPL-6550
HCPL-6551
HCPL-655K
Gold Plate
HCPL-6530
HCPL-6531
HCPL-653K
Solder Pads
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
4N55/883B
HCPL-257K
Gold Plate
Option #200
Option #100
Option #300
Option #200
Option #100
Option #300
Option #200
Option #100
Option #300
Butt Cut/Gold Plate
Gull Wing/Soldered
SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
5962-
5962-
5962-
5962-
5962-
8767901EX
8767901EC
8767901EA
8767901UC
8767901UA
8767901TA
9085401HPX
9085401HPC
9085401HPA
9085401HYC
9085401HYA
9085401HXA
8767902PX
8767902PC
8767902PA
8767902YC
8767902YA
8767902XA
8767904FX
8767904FC
87679032X
Solder Dipped
87679032A
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
*JEDEC registered part.
1-560
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