Datasheet > 4N55883B

4N55883B

更新时间： 2022-11-25 23:50:29

品牌	Logo	应用领域
安捷伦 - AGILENT		晶体光电晶体管
页数	文件大小	规格书
12页	244K
描述
Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications

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数据手册

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4N55883B 数据手册

Functional Diagrams

16 Pin DIP

Through Hole

2 Channels

8 Pin DIP

Through Hole

1 Channel

8 Pin DIP

Through Hole

2 Channels

16 Pin Flat Pack

Unformed Leads

4 Channels

20 Pad LCCC

Surface Mount

2 Channels

15 14

CC2

OC1

GND

OUT

CC1

GND

CC2

GND

Note: 8 pin DIP and flat pack devices have common V_CCand ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages

have isolated channels with separate V_CCand ground connections.

Outline Drawings

16 Pin DIP Through Hole, 2 Channels

20.06 (0.790)

20.83 (0.820)

8.13 (0.320)

MAX.

0.89 (0.035)

1.65 (0.065)

4.45 (0.175)

MAX.

0.51 (0.020)

MIN.

3.81 (0.150)

MIN.

0.20 (0.008)

0.33 (0.013)

7.36 (0.290)

7.87 (0.310)

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

Leaded Device Marking

Leadless Device Marking

HP LOGO

HP P/N

DESC SMD*

PIN ONE/

HP QYYWWZ

XXXXXX

XXXXXXX

XXX USA

* 50434

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

HP LOGO

HP P/N

PIN ONE/

HP QYYWWZ

XXXXXX

* XXXX

XXXXXX

USA 50434

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

DESC SMD*

HP FSCN*

COUNTRY OF MFR.

HP FSCN*

ESD IDENT

COUNTRY OF MFR.

ESD IDENT

* QUALIFIED PARTS ONLY

*QUALIFIED PARTS ONLY

1-561

1 234 5 6 7...12

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