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48SD6404RPFE PDF预览

48SD6404RPFE

更新时间: 2024-02-01 19:56:26
品牌 Logo 应用领域
麦斯威 - MAXWELL 动态存储器
页数 文件大小 规格书
42页 595K
描述
256 Mb SDRAM 16-Meg X 4-Bit X 4-Banks

48SD6404RPFE 技术参数

生命周期:Contact Manufacturer零件包装代码:DFP
包装说明:DFP,针数:72
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.33
Is Samacsys:N访问模式:FOUR BANK PAGE BURST
最长访问时间:6 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-XDFP-F72长度:26.67 mm
内存密度:268435456 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:4功能数量:1
端口数量:1端子数量:72
字数:67108864 words字数代码:64000000
工作模式:SYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:64MX4
封装主体材料:UNSPECIFIED封装代码:DFP
封装形状:RECTANGULAR封装形式:FLATPACK
认证状态:Not Qualified座面最大高度:4.16 mm
自我刷新:YES最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:FLAT
端子节距:0.635 mm端子位置:DUAL
宽度:19 mmBase Number Matches:1

48SD6404RPFE 数据手册

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48SD6404  
256Mb (16-Meg X 4-Bit X 4-Banks) SDRAM  
TABLE 5. AC Electrical Characteristics  
(V =3.3V + 0.3V, V Q = 3.3V + 0.3V, T = -55 TO 125°C, UNLESS OTHERWISE SPECIFIED)  
CC  
CC  
A
PARAMETER  
SYMBOL  
SUBGROUPS  
MIN  
TYP  
MAX  
UNIT  
System clock cycle time1  
tCK  
9, 10, 11  
ns  
(CAS latency = 2)  
(CAS latency = 3)  
10  
7.5  
CLK high pulse width1,7  
CLK low pulse width1,7  
tCKH  
tCKL  
tAC  
9, 10, 11  
9, 10, 11  
9, 10, 11  
2.5  
2.5  
ns  
ns  
ns  
1,2  
Access time from CLK  
(CAS latency = 2)  
(CAS latency = 3)  
6
6
Data-out hold time1,2  
CLK to Data-out low impedance1,2,3,7  
CLK to Data-out high impedance1,4  
(CAS latency = 2, 3)  
tOH  
tLZ  
9, 10, 11  
9, 10, 11  
9, 10, 11  
2.7  
2
ns  
ns  
ns  
tHZ  
5.4  
Input setup time1,5,6  
tAS, tCS,  
tDS, tCES  
9, 10, 11  
1.5  
ns  
CKE setup time for power down exit1  
Input hold time1,6  
tCESP  
9, 10, 11  
9, 10, 11  
1.5  
1.5  
ns  
ns  
tAH, tCH, tDH  
tCEH  
Ref/Active to Ref/Active command period1  
Active to Precharge command period1  
tRC  
tRAS  
tRCD  
9, 10, 11  
9, 10, 11  
9, 10, 11  
70  
50  
20  
ns  
ns  
ns  
120000  
Active command to column command  
(same bank)1  
Precharge to Active command period1  
Write recovery or data-in to precharge lead time1  
Active( a) to Active (b) command period1  
Transition time(rise and fall)7  
tRP  
tDPL  
tRRD  
tT  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
@ 105 °C  
@ 85 °C  
@ 70 °C  
20  
20  
20  
1
ns  
ns  
ns  
ns  
ms  
5
Refresh Period  
tREF  
16  
32  
6.4  
168  
64  
128  
1. AC measurements assume tT=1 ns. Reference level for timing of input signals is 1.5V.  
2. Access time is measured at 1.5V.  
3. tLZ(min) defines the time at which the outputs achieve the low impedance state.  
4. tHZ(min) defines the time at which the outputs achieve the high impedance state.  
5. tCES defines CKE setup time to CLK rising edge except fot the power down exit command.  
6. tAS/tAH: Address, tCS/tCH: /CS, /RAS, /CAS, /WE, DQM  
7. Guaranteed by design. (Not tested)  
8. Guarenteed by Device Characterization Testing. (Not 100% Tested)  
01.11.05 Rev 2  
All data sheets are subject to change without notice  
5
©2005 Maxwell Technologies  
All rights reserved.  

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