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SEMICONDUCTOR TECHNICAL DATA
N–Channel Enhancement–Mode Silicon Gate
TMOS POWER FET
This advanced high–cell density HDTMOS power FET is
designed to withstand high energy in the avalanche and commuta-
tion modes. This new energy efficient design also offers a
drain–to–source diode with a fast recovery time. Designed for low
voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating area are critical and offer additional safety margin
against unexpected voltage transients.
75 AMPERES
30 VOLTS
R
= 0.0065 OHM
DS(on)
•
•
Avalanche Energy Specified
Source–to–Drain Diode Recovery Time Comparable
to a Discrete Fast Recovery Diode
•
•
Diode is Characterized for Use in Bridge Circuits
I
and V
Specified at Elevated Temperature
DSS
DS(on)
CASE 221A–06
TO–220AB
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
Rating
Symbol
Value
30
Unit
Vdc
Vdc
Drain–to–Source Voltage
V
DSS
Drain–to–Gate Voltage (R
GS
= 1.0 MΩ)
V
DGR
30
Gate–to–Source Voltage — Continuous
— Non–Repetitive (t ≤ 10 ms)
V
± 20
± 20
Vdc
Vpk
GS
V
GSM
p
Drain Current — Continuous
— Continuous @ 100°C
— Single Pulse (t ≤ 10 µs)
I
I
75
59
225
Adc
Apk
D
D
I
p
DM
Total Power Dissipation
Derate above 25°C
P
D
150
1.2
Watts
W/°C
Operating and Storage Temperature Range
T , T
J stg
–55 to 150
°C
Single Pulse Drain–to–Source Avalanche Energy — Starting T = 25°C
E
AS
mJ
J
(V
DD
= 25 Vdc, V
= 10 Vdc, Peak I = 75 Apk, L = 0.1 mH, R = 25 Ω)
GS L G
280
Thermal Resistance — Junction–to–Case
— Junction–to–Ambient
R
R
0.8
62.5
°C/W
°C
θJC
θJA
Maximum Lead Temperature for Soldering Purposes, 1/8″ from Case for 5.0 seconds
T
260
L
This document contains information on a new product. Specifications and information herein are subject to change without notice.
E–FET and HDTMOS are trademarks of Motorola, Inc.
Motorola TMOS Power MOSFET Transistor Device Data
1
Motorola, Inc. 1997