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48F4268 PDF预览

48F4268

更新时间: 2024-10-02 23:21:35
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其他 - ETC 晶体晶体管
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8页 177K
描述
TRANSISTOR MOSFET TO-220

48F4268 数据手册

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Order this document  
by MTP1306/D  
SEMICONDUCTOR TECHNICAL DATA  
N–Channel Enhancement–Mode Silicon Gate  
TMOS POWER FET  
This advanced high–cell density HDTMOS power FET is  
designed to withstand high energy in the avalanche and commuta-  
tion modes. This new energy efficient design also offers a  
drain–to–source diode with a fast recovery time. Designed for low  
voltage, high speed switching applications in power supplies,  
converters and PWM motor controls, these devices are particularly  
well suited for bridge circuits where diode speed and commutating  
safe operating area are critical and offer additional safety margin  
against unexpected voltage transients.  
75 AMPERES  
30 VOLTS  
R
= 0.0065 OHM  
DS(on)  
Avalanche Energy Specified  
Source–to–Drain Diode Recovery Time Comparable  
to a Discrete Fast Recovery Diode  
Diode is Characterized for Use in Bridge Circuits  
I
and V  
Specified at Elevated Temperature  
DSS  
DS(on)  
CASE 221A–06  
TO–220AB  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol  
Value  
30  
Unit  
Vdc  
Vdc  
Drain–to–Source Voltage  
V
DSS  
Drain–to–Gate Voltage (R  
GS  
= 1.0 M)  
V
DGR  
30  
Gate–to–Source Voltage — Continuous  
— Non–Repetitive (t 10 ms)  
V
± 20  
± 20  
Vdc  
Vpk  
GS  
V
GSM  
p
Drain Current — Continuous  
— Continuous @ 100°C  
— Single Pulse (t 10 µs)  
I
I
75  
59  
225  
Adc  
Apk  
D
D
I
p
DM  
Total Power Dissipation  
Derate above 25°C  
P
D
150  
1.2  
Watts  
W/°C  
Operating and Storage Temperature Range  
T , T  
J stg  
55 to 150  
°C  
Single Pulse Drain–to–Source Avalanche Energy — Starting T = 25°C  
E
AS  
mJ  
J
(V  
DD  
= 25 Vdc, V  
= 10 Vdc, Peak I = 75 Apk, L = 0.1 mH, R = 25 )  
GS L G  
280  
Thermal Resistance — Junction–to–Case  
— Junction–to–Ambient  
R
R
0.8  
62.5  
°C/W  
°C  
θJC  
θJA  
Maximum Lead Temperature for Soldering Purposes, 1/8from Case for 5.0 seconds  
T
260  
L
This document contains information on a new product. Specifications and information herein are subject to change without notice.  
E–FET and HDTMOS are trademarks of Motorola, Inc.  
Motorola, Inc. 1997  

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