2N7002KA
NXP Semiconductors
N-channel TrenchMOS FET
6. Characteristics
Table 5.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Static characteristics
V(BR)DSS drain-source breakdown
voltage
ID = 10 µA; VGS = 0 V
Tj = 25 °C
60
55
16
75
-
-
-
-
V
V
V
Tj = −55 °C
V(BR)GSS gate-source breakdown
voltage
IG = ±1 mA; VDS = 0 V
22
VGS(th)
gate-source threshold voltage ID = 1 mA; VDS = VGS; see Figure 9 and 10
Tj = 25 °C
Tj = 150 °C
Tj = −55 °C
1
2
-
-
V
V
V
0.6
-
-
-
3.5
IDSS
drain leakage current
gate leakage current
VDS = 48 V; VGS = 0 V
Tj = 25 °C
-
-
-
0.01
-
1
µA
µA
nA
Tj = 150 °C
10
500
IGSS
VGS = ±10 V; VDS = 0 V
VGS = 10 V; ID = 500 mA; see Figure 6 and 8
Tj = 25 °C
50
RDSon
drain-source on-state
resistance
-
-
-
2.8
-
4.4
Ω
Ω
Ω
Tj = 150 °C
8.14
5.3
VGS = 4.5 V; ID = 75 mA; see Figure 6 and 8
3.8
Dynamic characteristics
Ciss
Coss
Crss
ton
input capacitance
output capacitance
reverse transfer capacitance
turn-on time
VGS = 0 V; VDS = 10 V; f = 1 MHz;
see Figure 12
-
-
-
-
-
13
8
40
30
10
10
15
pF
pF
pF
ns
ns
4
VDS = 50 V; RL = 250 Ω; VGS = 10 V;
RG = 50 Ω; RGS = 50 Ω
3
toff
turn-off time
9
Source-drain diode
VSD
trr
source-drain voltage
IS = 300 mA; VGS = 0 V; see Figure 11
-
-
-
0.85 1.5
V
reverse recovery time
recovered charge
IS = 300 mA; dIS/dt = −100 A/µs; VGS = 0 V;
30
30
-
-
ns
nC
VDS = 25 V
Qr
2N7002KA_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 25 September 2007
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