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2N7002K_12 PDF预览

2N7002K_12

更新时间: 2022-03-30 22:26:05
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 112K
描述
Small Signal MOSFET 60 V, 380 mA, Single, N.Channel, SOT.23

2N7002K_12 数据手册

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2N7002K, 2V7002K  
Small Signal MOSFET  
60 V, 380 mA, Single, NChannel, SOT23  
Features  
ESD Protected  
Low R  
DS(on)  
http://onsemi.com  
Surface Mount Package  
2V Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AECQ101 Qualified and  
PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
1.6 W @ 10 V  
2.5 W @ 4.5 V  
60 V  
380 mA  
SIMPLIFIED SCHEMATIC  
Applications  
Low Side Load Switch  
Level Shift Circuits  
Gate  
1
DCDC Converter  
3
Drain  
Portable Applications i.e. DSC, PDA, Cell Phone, etc.  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Source  
2
Rating  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
(Top View)  
V
GS  
20  
V
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Drain  
Drain Current (Note 1)  
Steady State 1 sq in Pad  
I
D
mA  
T = 25°C  
A
380  
270  
3
A
T = 85°C  
3
Drain Current (Note 2)  
I
mA  
D
1
Steady State Minimum Pad  
T = 25°C  
A
320  
230  
A
2
T = 85°C  
704 MG  
SOT23  
CASE 318  
STYLE 21  
Power Dissipation  
Steady State 1 sq in Pad  
Steady State Minimum Pad  
P
mW  
G
D
420  
300  
1
2
Gate  
Source  
Pulsed Drain Current (t = 10 ms)  
I
1.5  
A
p
DM  
704  
M
= Specific Device Code*  
= Date Code*  
= PbFree Package  
Operating Junction and Storage  
Temperature Range  
T , T  
55 to  
+150  
°C  
J
STG  
G
(Note: Microdot may be in either location)  
Source Current (Body Diode)  
I
S
300  
260  
mA  
*Specific Device Code, Date Code or overbar  
orientation and/or location may vary depend-  
ing upon manufacturing location. This is a  
representation only and actual devices may  
not match this drawing exactly.  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
°C  
L
GateSource ESD Rating  
(HBM, Method 3015)  
ESD  
2000  
V
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 sq in pad size with 1 oz Cu.  
2. Surfacemounted on FR4 board using 0.08 sq in pad size with 1 oz Cu.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
2N7002KT1G  
SOT23  
3000 / Tape & Reel  
(PbFree)  
2V7002KT1G  
SOT23  
3000 / Tape & Reel  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
May, 2012 Rev. 10  
2N7002K/D  
 

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