Datasheet > 2N3771_00

2N3771_00

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		晶体晶体管高功率电源
页数	文件大小	规格书
5页	86K
描述
HIGH POWER NPN SILICON TRANSISTOR

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2N3771_00 数据手册

2N3771, 2N3772

2N3771 is a Preferred Device

High Power NPN Silicon

Power Transistors

These devices are designed for linear amplifiers, series pass

regulators, and inductive switching applications.

Features

http://onsemi.com

• Forward Biased Second Breakdown Current Capability

20 and 30 AMPERE

POWER TRANSISTORS

NPN SILICON

= 3.75 Adc @ V = 40 Vdc − 2N3771

S/b

= 2.5 Adc @ V = 60 Vdc − 2N3772

• Pb−Free Packages are Available*

40 and 60 VOLTS, 150 WATTS

MAXIMUM RATINGS (Note 1)

Rating

Symbol 2N3771 2N3772 Unit

MARKING

DIAGRAM

Collector−Emitter Voltage

Collector−Base Voltage

Emitter−Base Voltage

5.0

Vdc

Adc

CEO

CEX

100

7.0

Collector Current − Continuous

Peak

2N377xG

AYYWW

MEX

TO−204AA (TO−3)

Base Current −

Continuous

Peak

7.5

5.0

Adc

CASE 1−07

STYLE 1

Total Device Dissipation @ T = 25°C

Derate above 25°C

150

0.855

W/°C

Operating and Storage Junction

Temperature Range

T , T

–65 to +200

°C

2N377x = Device Code

x = 1 or 2

stg

MEX

= Pb−Free Package

= Assembly Location

= Year

= Work Week

= Country of Origin

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Thermal Resistance,

Junction−to−Case

1.17

°C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

ORDERING INFORMATION

Shipping

Device

Package

1. Indicates JEDEC registered data.

2N3771

TO−204

100 Units / Tray

2N3771G

TO−204

(Pb−Free)

2N3772

TO−204

100 Units / Tray

2N3772G

TO−204

(Pb−Free)

Preferred devices are recommended choices for future use

and best overall value.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

October, 2006 − Rev. 11

2N3771/D

12 3 4 5

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