Datasheet > 298D106X0004K2T

298D106X0004K2T

更新时间： 2022-12-14 18:37:06

品牌	Logo	应用领域
威世 - VISHAY		电容器钽电容器
页数	文件大小	规格书
11页	214K
描述
Solid Tantalum Chip Capacitors MICROTAN™ Leadframeless Molded

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298D106X0004K2T 数据手册

298D

Solid Tantalum Chip Capacitors

MICROTAN Leadframeless Molded

Vishay Sprague

™

MECHANICAL PERFORMANCE CHARACTERISTICS

Resistance to Solder

Heat

At 260 °C, for 10 s, reflow

Capacitance Change

Dissipation Factor

Leakage Current

Refer to Standard Ratings Table

Not to exceed 150 ꢀ of initial

Not to exceed 200 ꢀ of initial

There shall be no mechanical or visual damage to capacitors

post-conditioning.

Solderability

MIL-STD-202G, Method 208H, ANSI/J-Std-002,

Test B. Applies only to solder and tin plated

terminations. Does not apply to gold terminations.

There shall be no mechanical or visual damage to capacitors

post-conditioning.

Resistance to

Solvents

MIL-STD-202, Method 215D

There shall be no mechanical or visual damage to capacitors

post-conditioning.

Flammability

Encapsulation materials meet UL94 VO with an

oxygen index of 32 ꢀ.

TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY

“M” Case

100

IMPEDANCE

ESR

IMPEDANCE

ESR

47 µF - 4 V

22 µF - 4 V

100 1000

0.1

100

1000

0.1

FREQUENCY, kHz

“M” Case

1000

100

1000

100

IMPEDANCE

ESR

IMPEDANCE

ESR

4.7 µF - 10 V

10 µF - 6 V

100 1000

0.1

100

1000

FREQUENCY, kHz

www.vishay.com

For technical questions, contact: tantalum@vishay.com

Document Number: 40065

Revision: 01-Sep-08

1 2 3 456 7 8...11

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